Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-11769607-B2
Application number	US-202117527417-A
Country	US
Kind code	B2
Filing date	Nov 16, 2021
Priority date	Jul 6, 2015
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

First claim

The invention claimed is:

1. A resin composition, comprising:
a maleimide compound,
a cyanate ester compound, the content of the cyanate ester compound is 0.01 to 40 parts by mass based on 100 parts by mass in total of resins and components that form resins by polymerization in the resin composition,
a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and
an inorganic filler,
wherein the cyanate ester compound comprises a compound represented by the following formula (7):

wherein:
each R 6 independently represents a hydrogen atom or a methyl group, and
n 2 represents an integer of 1 or larger.

2. The resin composition according to claim 1 , wherein the resin composition comprises, as the silane compound, a compound represented by the following formula (A):

wherein:
R 8 represents the hydrolyzable group or the hydroxy group;
R 9 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms;
when a plurality of R 8 or R 9 are present, the plurality of R 8 or R 9 are the same as or different from each other; and
k represents an integer of 1 to 3.

3. The resin composition according to claim 1 , wherein the resin composition comprises, as the maleimide compound, at least one compound selected from the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and a maleimide compound represented by the following formula (6):

wherein:
each R 5 independently represents a hydrogen atom or a methyl group, and
n 1 represents an integer of 1 or larger.

4. The resin composition according to claim 1 , wherein the inorganic filler is surface-treated in advance with the silane compound.

5. The resin composition according to claim 1 , wherein the content of the silane compound is 0.1 to 15 parts by mass based on 100 parts by mass in total of resins and components that form resins by polymerization in the resin composition.

6. The resin composition claim 1 , wherein the inorganic filler comprises at least one selected from the group consisting of silica, alumina, and aluminum nitride.

7. The resin composition according to claim 1 , wherein the content of the inorganic filler is 100 to 1100 parts by mass based on 100 parts by mass in total of resins and components that form resins by polymerization in the resin composition.

8. A prepreg comprising a base material and a resin composition according to claim 1 , the base material being impregnated or coated with the resin composition.

9. The prepreg according to claim 8 , wherein the base material is at least one material selected from the group consisting of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and an organic fiber cloth.

10. A resin sheet comprising a support and a resin composition according to claim 1 , the support being coated with the resin composition.

11. A laminate comprising a cured product of the resin composition according to claim 1 , wherein the laminate comprises one or more layers, wherein the one or more layers comprises at least one of:
a prepreg comprising a base material impregnated or coated with the cured product, and
a resin sheet comprising a support coated with the cured product.

12. A metal foil-clad laminate comprising a cured product of the resin composition according to claim 1 , wherein the metal foil-clad laminate comprises:
a metal foil disposed on one side or both sides of at least one of:
a prepreg comprising a base material impregnated or coated with the cured product, and
a resin sheet comprising a support coated with the cured product.

13. A printed circuit board comprising an insulating layer and a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises a cured product of a resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Tomizawa Katsuya
• Takano Yoichi
• ITO Meguru
• Shiga Eisuke

Classifications

• H01B3/442 Primary

  from aromatic vinyl compounds · CPC title

• B32B5/00

  Layered products characterised by the non- homogeneity or physical structure {, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts} · CPC title

• B32B27/00

  Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} · CPC title

• B32B27/34

  comprising polyamides · CPC title

• C08J5/244

  using glass fibres · CPC title