Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-10550228-B2
Application number	US-201615737490-A
Country	US
Kind code	B2
Filing date	Jul 4, 2016
Priority date	Jul 6, 2015
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

First claim

The invention claimed is:

1. A resin composition comprising:
an allyl group-containing compound (A); and
a maleimide compound (B),
wherein the allyl group-containing compound (A) comprises a bisphenol compound in which a hydrogen element of an aromatic ring is substituted with an allyl group and a hydrogen element of an aromatic ring is substituted with a cyanate group, and/or a modified bisphenol compound in which a hydrogen element of an aromatic ring is substituted with an allyl group and a phenol-based hydroxyl group is substituted with a cyanate group.

2. The resin composition according to claim 1 , wherein the allyl group-containing compound (A) comprises a compound represented by the following formula (7-1):

3. The resin composition according to claim 1 , wherein the allyl group-containing compound (A) further comprises a compound represented by the following formula (7-2):

4. The resin composition according to claim 1 , wherein a content of the allyl group-containing compound (A) is 1 to 90 parts by mass based on 100 parts by mass of a resin solid content.

5. The resin composition according to claim 1 , further comprising a filler (C).

6. The resin composition according to claim 5 , wherein a content of the filler (C) is 50 to 1600 parts by mass based on 100 parts by mass of a resin solid content.

7. The resin composition according to claim 5 , wherein the filler (C) comprises at least one selected from the group consisting of silica, alumina, magnesium oxide, aluminum hydroxide, boehmite, boron nitride, agglomerated boron nitride, silicon nitride and aluminum nitride.

8. The resin composition according to claim 5 , wherein the filler (C) is one, two or more selected from the group consisting of alumina, boron nitride, agglomerated boron nitride, silicon nitride, and aluminum nitride.

9. The resin composition according to claim 1 , further comprising one, two or more selected from the group consisting of an allyl group-containing compound different from the allyl group-containing compound (A), a cyanate ester compound, an epoxy resin, a phenol resin, an oxetane resin, a benzoxazine compound, and a compound having a polymerizable unsaturated group.

10. A metal foil-clad laminate comprising:
at least one layer of a prepreg or a resin sheet; and
a metal foil disposed on one side or both sides of the prepreg or the resin sheet,
wherein the prepreg comprises a base material; and the resin composition according to claim 1 impregnated in or coated on the base material, and the resin sheet comprises a sheet base material; and the resin composition laminated on one side or both sides of the sheet base material.

11. A printed circuit board, comprising an insulating layer and a conductive layer formed on a surface of the insulating layer, wherein the insulating layer contains the resin composition according to claim 1 .

12. The resin composition according to claim 1 , wherein the bisphenol part of the bisphenol compound and/or the modified bisphenol compound is bisphenol A, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol C, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol S, bisphenol P, bisphenol PH, bisphenol TMC, or bisphenol Z.

13. A resin composition comprising:
an allyl group-containing compound (A);
a maleimide compound (B); and
an alkenyl-substituted nadimide compound (D),
wherein the allyl group-containing compound (A) comprises a bisphenol compound in which a hydrogen element of an aromatic ring is substituted with an allyl group and a hydrogen element of an aromatic ring is substituted with a cyanate group, and/or a modified bisphenol compound in which a hydrogen element of an aromatic ring is substituted with an allyl group and a phenol-based hydroxyl group is substituted with a cyanate group.

14. The resin composition according to claim 13 , further comprising an epoxy resin.

15. The resin composition according to claim 14 , wherein a content of the epoxy resin is 2.5 to 30 parts by mass based on 100 parts by mass of a resin solid content.

16. The resin composition according to claim 13 , wherein the alkenyl-substituted nadimide compound (D) comprises a compound represented by the following formula (1):

wherein each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (2) or (3):

wherein R 3 represents a methylene group, an isopropylidene group, or a substituent represented by CO, O, S or SO 2 , and

wherein each R 4 independently represents an alkylene group having 1 to 4 carbon atoms, or a cycloalkylene group having 5 to 8 carbon atoms.

17. The resin composition according to claim 13 , wherein the alkenyl-substituted nadimide compound (D) comprises a compound represented by the following formula (4) and/or (5):

18. The resin composition according to claim 13 , wherein the maleimide compound (B) comprises at least one selected from the group consisting of bis(4-maleimidephenyl)methane, 2,2-bis{4-(4-maleimidephenoxy)-phenyl}propane, bis(3 -ethyl-5-methyl-4-maleimidephenyl)methane, and a maleimide compound represented by the following formula (6):

wherein each R 5 independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more.

19. The resin composition according to claim 13 , wherein the allyl group-containing compound comprises a compound represented by the following formula (7):

wherein each Ra independently represents the reactive functional group other than an allyl group.

20. The resin composition according to claim 13 , further comprising a filler (C).

21. The resin composition according to claim 20 , wherein the filler (C) comprises boehmite and/or a silica.

22. The resin composition according to claim 20 , wherein a content of the filler (C) is 80 to 300 parts by mass based on 100 parts by mass of a resin solid content.

23. The resin composition according to claim 13 , wherein a content of the alkenyl-substituted nadimide compound (D) is 25 to 90 parts by mass based on 100 parts by mass of a resin solid content.

24. The resin composition according to claim 13 , wherein a content of the maleimide compound (B) is 35 to 65 parts by mass based on 100 parts by mass of a resin solid content.

25. The resin composition according to claim 13 , wherein a content of the allyl group-containing compound (A) is 1.0 to 15 parts by mass based on 100 parts by mass of a res

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kashima Naoki
• Tomizawa Katsuya
• ITO Meguru
• HAMAJIMA Tomoki
• Shiga Eisuke
• Takano Kentaro
• Koga Shota

Classifications

• H01B3/306

  Polyimides or polyesterimides · CPC title

• C08K3/36

  Silica · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C08K3/22

  of metals · CPC title

• C08F226/06

  by a heterocyclic ring containing nitrogen · CPC title