Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-2018186933-A1
Application number	US-201615737490-A
Country	US
Kind code	A1
Filing date	Jul 4, 2016
Priority date	Jul 6, 2015
Publication date	Jul 5, 2018
Grant date	—

Abstract

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

First claim

1 . A resin composition comprising:
an allyl group-containing compound (A); and a maleimide compound (B), wherein the allyl group-containing compound (A) has a reactive functional group other than the allyl group.

2 . The resin composition according to claim 1 ,
wherein the reactive functional group comprises at least one selected from the group consisting of a cyanate group, a hydroxyl group and an epoxy group.

3 . The resin composition according to claim 1 ,
wherein the reactive functional group comprises a cyanate group.

4 . The resin composition according to claim 1 ,
wherein the allyl group-containing compound (A) comprises an allyl group-containing compound having a cyanate group as the reactive functional group, and an allyl group-containing compound having an epoxy group as the reactive functional group.

5 . The resin composition according to claim 1 ,
wherein the allyl group-containing compound (A) comprises a compound represented by the following formula (7-1):

6 . The resin composition according to claim 1 ,
wherein the allyl group-containing compound (A) comprises a compound represented by the following formula (7-2):

7 . The resin composition according to claim 1 ,
wherein a content of the allyl group-containing compound (A) is 1 to 90 parts by mass based on 100 parts by mass of a resin solid content.

8 . The resin composition according to claim 1 , further comprising a filler (C).

9 . The resin composition according to claim 8 ,
wherein a content of the filler (C) is 50 to 1600 parts by mass based on 100 parts by mass of a resin solid content.

10 . The resin composition according to claim 8 ,
wherein the filler (C) comprises at least one selected from the group consisting of silica, alumina, magnesium oxide, aluminum hydroxide, boehmite, boron nitride, agglomerated boron nitride, silicon nitride and aluminum nitride.

11 . The resin composition according to claim 8 ,
wherein the filler (C) is one, two or more selected from the group consisting of alumina, boron nitride, agglomerated boron nitride, silicon nitride, and aluminum nitride.

12 . The resin composition according to claim 1 , further comprising one, two or more selected from the group consisting of an allyl group-containing compound different from the allyl group-containing compound (A), a cyanate ester compound, an epoxy resin, a phenol resin, an oxetane resin, a benzoxazine compound, and a compound having a polymerizable unsaturated group.

13 . A resin composition comprising:
an allyl group-containing compound (A); a maleimide compound (B); and an alkenyl-substituted nadimide compound (D), wherein the allyl group-containing compound (A) has a reactive functional group other than the allyl group.

14 . The resin composition according to claim 13 , further comprising an epoxy resin.

15 . The resin composition according to claim 13 ,
wherein the reactive functional group comprises at least one selected from the group consisting of a cyanate group, a hydroxyl group and an epoxy group.

16 . The resin composition according to claim 13 ,
wherein the reactive functional group comprises a cyanate group.

17 . The resin composition according to claim 13 ,
wherein the alkenyl-substituted nadimide compound (D) comprises a compound represented by the following formula (1):

wherein each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (2) or (3):

wherein R 3 represents a methylene group, an isopropylidene group, or a substituent represented by CO, O, S or SO 2 ; and

wherein each R 4 independently represents an alkylene group having 1 to 4 carbon atoms, or a cycloalkylene group having 5 to 8 carbon atoms.

18 . The resin composition according to claim 13 ,
wherein the alkenyl-substituted nadimide compound (D) comprises a compound represented by the following formula (4) and/or (5):

19 . The resin composition according to claim 13 ,
wherein the maleimide compound (B) comprises at least one selected from the group consisting of bis(4-maleimidephenyl)methane, 2,2-bis{4-(4-maleimidephenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, and a maleimide compound represented by the following formula (6):

wherein each R 5 independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more.

20 . The resin composition according to claim 13 , wherein the allyl group-containing compound comprises a compound represented by the following formula (7):

wherein each Ra independently represents the reactive functional group other than an allyl group.

21 . The resin composition according to claim 13 , further comprising a filler (C).

22 . The resin composition according to claim 21 ,
wherein the filler (C) comprises boehmite and/or a silica.

23 . The resin composition according to claim 13 ,
wherein a content of the alkenyl-substituted nadimide compound (D) is 25 to 90 parts by mass based on 100 parts by mass of a resin solid content.

24 . The resin composition according to claim 13 ,
wherein a content of the maleimide compound (B) is 35 to 65 parts by mass based on 100 parts by mass of a resin solid content.

25 . The resin composition according to claim 13 ,
wherein a content of the allyl group-containing compound (A) is 1.0 to 15 parts by mass based on 100 parts by mass of a resin solid content.

26 . The resin composition according to claim 14 ,
wherein a content of the epoxy resin is 2.5 to 30 parts by mass based on 100 parts by mass of a resin solid content.

27 . The resin composition according to claim 21 ,
wherein a content of the filler (C) is 80 to 300 parts by mass based on 100 parts by mass of a resin solid content.

28 . (canceled)

29 . (canceled)

30 . (canceled)

31 . A metal foil-clad laminate comprising:
at least one layer of a prepreg or a resin sheet; and a metal foil disposed on one side or both sides of the prepreg or the resin sheet, wherein the prepreg comprises a base material; and the resin composition according to claim 1 impregnated in or coated on the base material, and the resin sheet comprises a sheet base material; and the resin composition laminated on one side or both sides of the sheet base material

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kashima Naoki
• Tomizawa Katsuya
• ITO Meguru
• HAMAJIMA Tomoki
• Shiga Eisuke
• Takano Kentaro
• Koga Shota

Classifications

• C08G59/4014

  Nitrogen containing compounds · CPC title

• C08K3/36

  Silica · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C08F226/06

  by a heterocyclic ring containing nitrogen · CPC title

• B32B15/08

  of synthetic resin · CPC title