Electroless ruthenium plating bath
US-2026085426-A1 · Mar 26, 2026 · US
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Tanabe Katsuhisa patents
Tanabe Katsuhisa is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tanabe Katsuhisa |
| Total patents | 25 |
| First publication | Oct 10, 2019 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Etchant and method of surface treatment of aluminum or aluminum alloy
US-12454760-B2 · Oct 28, 2025 · US
Method and system for regenerating electrolytic copper plating solution
US-2024360586-A1 · Oct 31, 2024 · US
Catalyst application bath for electroless plating, method of producing catalytic nucleus-containing material to be electroless plated, method of producing material with electroless plating deposit, and material with electroless plating deposit
US-2024200196-A1 · Jun 20, 2024 · US
Electroless palladium plating solution
US-11946144-B2 · Apr 2, 2024 · US
Etchant and method of surface treatment of aluminum or aluminum alloy
US-2023407487-A1 · Dec 21, 2023 · US
Palladium plating solution and plating method
US-11814717-B2 · Nov 14, 2023 · US
Regeneration method for gold plating solution
US-2023203665-A1 · Jun 29, 2023 · US
Metal displacement solution, method for surface treatment of aluminum or aluminum alloy
US-2023151493-A1 · May 18, 2023 · US
Electroless gold plating bath
US-2023111446-A1 · Apr 13, 2023 · US
Recent patents
Latest publications not already listed above.
Method for fabricating electronic component
US-2022396881-A1 · Dec 15, 2022 · US
Multilayer plating film
US-2022388279-A1 · Dec 8, 2022 · US
Electroless palladium plating solution and palladium film
US-11492706-B2 · Nov 8, 2022 · US
Electroless palladium plating bath
US-2022033973-A1 · Feb 3, 2022 · US
Palladium Plating Solution And Plating Method
US-2021310127-A1 · Oct 7, 2021 · US
Electroless gold plating bath
US-10975475-B2 · Apr 13, 2021 · US
Film formation method
US-10941493-B2 · Mar 9, 2021 · US
Electroless palladium plating solution and palladium film
US-2021054508-A1 · Feb 25, 2021 · US
Electroless platinum plating bath
US-10822704-B2 · Nov 3, 2020 · US
Gold plating method and plating film
US-2020340120-A1 · Oct 29, 2020 · US
Electroless palladium plating solution
US-2020318239-A1 · Oct 8, 2020 · US
Electroless gold plating bath
US-2020283906-A1 · Sep 10, 2020 · US
Electroless palladium plating solution, and electroless palladium plated coating
US-2020248312-A1 · Aug 6, 2020 · US
Film formation method
US-2019345612-A1 · Nov 14, 2019 · US
Electroless platinum plating bath
US-2019309423-A1 · Oct 10, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Uemura Kogyo Kk | 25 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C18/44 | 19 |
| C23C18/1651 | 12 |
| C23C18/1831 | 8 |
| C23C18/42 | 8 |
| C23C18/32 | 7 |