CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
US-2020020660-A1 · Jan 16, 2020 · US
Electroless platinum plating bath
US10822704B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10822704-B2 |
| Application number | US-201716314844-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 27, 2017 |
| Priority date | Jul 4, 2016 |
| Publication date | Nov 3, 2020 |
| Grant date | Nov 3, 2020 |
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- Title
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Abstract
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An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.
First claim
Opening claim text (preview).
What is claimed is: 1. An electroless platinum plating solution comprising: a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid, wherein the halide ion supplying agent is an alkali metal halide. 2. The electroless platinum plating solution of claim 1 , wherein the halide ion supplying agent is included at a molar ratio of 10 or more with respect to platinum. 3. The electroless platinum plating solution of claim 2 , wherein the halide ion supplying agent is included at the molar ratio of 500 or less with respect to platinum. 4. The electroless platinum plating solution of claim 1 , wherein the alkali metal halide is at least one of sodium chloride, potassium chloride, sodium iodide, potassium iodide, sodium bromide, or potassium bromide. 5. The electroless platinum plating solution of claim 1 , wherein the electroless platinum plating solution has a pH of 9 or less. 6. The electroless platinum plating solution of claim 1 , wherein the soluble platinum compound is one of dinitrodiammine platinum, chloroplatinate, tetraammine platinum salt, and hexaammine platinum salt. 7. A method for manufacturing a platinum coating on a target by submerging the target into the electroless platinum plating solution of claim 1 .
Assignees
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Classifications
- C23C18/44Primary
using reducing agents · CPC title
Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title
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Frequently asked questions
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- What does patent US10822704B2 cover?
- An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification C23C18/44. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).