Electroless palladium plating solution

Patent metadata

Field	Value
Publication number	US-11946144-B2
Application number	US-201816753395-A
Country	US
Kind code	B2
Filing date	Oct 3, 2018
Priority date	Oct 6, 2017
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.

First claim

The invention claimed is:

1. An electroless Pd plating solution consisting of:
a Palladium compound;
a reducing agent;
a complexing agent;
a compound or metal containing at least one selected from the group consisting of Ge, Ce, Sm, and Y;
water; and
optionally, a sulfur-containing compound as a stabilizer,
wherein a pH of the electroless Pd plating solution is from 4 to 10, and
a total amount of the at least one selected from the group consisting of Ge, Ce, Sm, and Y in the electroless Pd plating solution is 1 g/L to 10 g/L.

2. The electroless Pd plating solution according to claim 1 , wherein
the complexing agent is at least one selected from the group consisting of ammonia and an amine compound.

3. The electroless Pd plating solution according to claim 1 , wherein
the reducing agent is at least one selected from the group consisting of formic acid, hydrazine, hypophosphorous compounds, phosphorous compounds, amine borane compounds, and hydroboron compounds.

4. The electroless Pd plating solution according to claim 1 , wherein the sulfur-containing compound is present.

5. The electroless Pd plating solution according to claim 1 , wherein
the pH of the electroless Pd plating solution is from 4 to 8.

Assignees

• Uemura Kogyo Kk

Inventors

• Maeda Tsuyoshi
• Tanabe Katsuhisa
• Kawahara Tomohiro

Classifications

• C23C18/44 Primary

  using reducing agents · CPC title

• C09D5/00

  Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title

• C09D5/024

  characterised by the additives · CPC title

• C23C18/1651 Primary

  Two or more layers only obtained by electroless plating · CPC title