Electroless plating with at least two borane reducing agents
US-2015354064-A1 · Dec 10, 2015 · US
Electroless gold plating bath
US2020283906A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020283906-A1 |
| Application number | US-202016806328-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 2, 2020 |
| Priority date | Mar 6, 2019 |
| Publication date | Sep 10, 2020 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R 1 , R 2 , and R 3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.
First claim
Opening claim text (preview).
1 . An electroless gold plating bath, comprising: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R 1 , R 2 , and R 3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt. 2 . The electroless gold plating bath according to claim 1 , wherein the electroless gold plating bath contains no cyanide compound as an additive.
Assignees
Inventors
Classifications
- C23C18/44Primary
using reducing agents · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2020283906A1 cover?
- The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) …
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification C23C18/44. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).