Method and apparatus for preparing coated particles
US-2016369405-A1 · Dec 22, 2016 · US
Palladium Plating Solution And Plating Method
US2021310127A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021310127-A1 |
| Application number | US-202117219709-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 31, 2021 |
| Priority date | Apr 3, 2020 |
| Publication date | Oct 7, 2021 |
| Grant date | — |
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Abstract
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The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
First claim
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1 . A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound. 2 . The palladium plating solution according to claim 1 , wherein the sulfur compound is a compound represented by a general formula in below. R1-(CH 2 ) x —S—(CH 2 ) y —S—(CH 2 ) z —R2 wherein x=1 to 4, y=1 to 3, z=1 to 4, R1 or R2 is a functional group selected from —OH, —COOH, —CN 3 . The palladium plating solution according to claim 1 , wherein a concentration of the sulfur compound is 0.01 mg/L to 50 mg/L. 4 . The palladium plating solution according to claim 1 , wherein a concentration of the complexing agent is 0.5 g/L to 25 g/L. 5 . The palladium plating solution according to claim 1 , wherein the complexing agent is one or more compound containing a compound having at least an ethylenediamine or a propylenediamine represented by a general formula in below. 6 . A plating method using a palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising a palladium plating step for applying a palladium plating on a surface of an underlying metal, wherein a plating solution used for applying the palladium plating comprises: an aqueous palladium salt; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, and the plating solution is having two or more sulfide groups in a molecule of the sulfur compound. 7 . The plating method according to claim 6 , wherein the underlying metal is a gold, a nickel, a palladium, a copper, or an alloy thereof, or a combination thereof
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- What does patent US2021310127A1 cover?
- The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent…
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification C23C18/42. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Oct 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).