Connector
US-D1115713-S · Mar 3, 2026 · US
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Takenaga Yuichi patents
Takenaga Yuichi is listed as an inventor on 92 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Takenaga Yuichi |
| Total patents | 92 |
| First publication | Jan 8, 2015 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Recipe optimization method and heat treatment apparatus
US-2025361618-A1 · Nov 27, 2025 · US
Connector
US-D1098045-S · Oct 14, 2025 · US
Temperature correction information calculating device, semiconductor manufacturing apparatus, recording medium, and temperature correction information calculating method
US-12431373-B2 · Sep 30, 2025 · US
Temperature correction information calculation device, semiconductor manufacturing apparatus, storage medium, and temperature correction information calculation method
US-12431396-B2 · Sep 30, 2025 · US
Connector
US-D1094298-S · Sep 23, 2025 · US
Connector
US-D1094297-S · Sep 23, 2025 · US
Information processing apparatus, substrate processing apparatus, and information processing method
US-2025291343-A1 · Sep 18, 2025 · US
Connector
US-D1093318-S · Sep 16, 2025 · US
Substrate processing apparatus and temperature regulation method
US-12341039-B2 · Jun 24, 2025 · US
Recent patents
Latest publications not already listed above.
Information processing device, recording medium, and process condition search method
US-12253838-B2 · Mar 18, 2025 · US
Temperature control method and substrate processing apparatus
US-2025051922-A1 · Feb 13, 2025 · US
Substrate processing method and substrate processing apparatus
US-2025046658-A1 · Feb 6, 2025 · US
Control device, system and control method
US-12165892-B2 · Dec 10, 2024 · US
Substrate processing system and display method
US-2024404849-A1 · Dec 5, 2024 · US
Optimizing plasma resources for targeted film
US-12020914-B2 · Jun 25, 2024 · US
Information processing apparatus and parameter control method
US-2024087925-A1 · Mar 14, 2024 · US
Substrate processing apparatus and temperature regulation method
US-2024014054-A1 · Jan 11, 2024 · US
Socket connector and manufacturing method thereof
US-2024006799-A1 · Jan 4, 2024 · US
Substrate processing apparatus and temperature regulation method
US-2023416919-A1 · Dec 28, 2023 · US
Substrate processing apparatus, information processing apparatus, and substrate processing method
US-11804395-B2 · Oct 31, 2023 · US
Temperature correction information calculating device, semiconductor manufacturing apparatus, recording medium, and temperature correction information calculating method
US-2022406631-A1 · Dec 22, 2022 · US
Temperature correction information calculation device, semiconductor manufacturing apparatus, storage medium, and temperature correction information calculation method
US-2022392814-A1 · Dec 8, 2022 · US
Board-to-board connector
US-11522308-B2 · Dec 6, 2022 · US
Substrate processing apparatus, information processing apparatus, and substrate processing method
US-2022270904-A1 · Aug 25, 2022 · US
Board-to-board connector
US-11424564-B2 · Aug 23, 2022 · US
Deposition system and deposition method
US-2022259729-A1 · Aug 18, 2022 · US
Board-to-board connector
US-11417975-B2 · Aug 16, 2022 · US
Information processing device, recording medium, and process condition search method
US-2022244685-A1 · Aug 4, 2022 · US
Board-to-board connector
US-11367973-B2 · Jun 21, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 51 |
| Japan Aviation Electronics Ind Ltd | 34 |
| Japan Aviation Electron | 5 |
| Jae Electronics Inc | 4 |
| Sony Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0604 | 34 |
| H01L21/67253 | 22 |
| C23C16/52 | 22 |
| H10P72/0602 | 21 |
| H01R12/716 | 19 |