Temperature correction information calculating device, semiconductor manufacturing apparatus, recording medium, and temperature correction information calculating method

Patent metadata

Field	Value
Publication number	US-12431373-B2
Application number	US-202217805952-A
Country	US
Kind code	B2
Filing date	Jun 8, 2022
Priority date	Jun 17, 2021
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A temperature correction information calculating device for use with a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus is configured to correct a preset temperature in accordance with an accumulated film thickness on an inner wall of the semiconductor manufacturing apparatus, control a temperature by using a heater such that the temperature approaches the corrected preset temperature, and perform a deposition process on an object. The temperature correction information calculating device includes a memory, and a processor coupled to the memory and configured to store a temperature correction value for correcting the preset temperature, obtain first heater power applied to the heater, predict second heater power by adding, to the first heater power, a variation of heater power due to a preset temperature change, and correct the temperature correction value based on the predicted second heater power. The first heater power is included in log information.

First claim

What is claimed is:

1. A system comprising:
a semiconductor manufacturing apparatus; and
a temperature correction information calculating device for use with the semiconductor manufacturing apparatus,
the semiconductor manufacturing apparatus including:
a first memory; and
a first processor coupled to the first memory and configured to
correct a preset temperature in accordance with an accumulated film thickness on an inner wall of the semiconductor manufacturing apparatus,
control a temperature by using a heater such that the temperature approaches the corrected preset temperature in the semiconductor manufacturing apparatus, and
perform a deposition process on an object, and

the temperature correction information calculating device including:
a second memory; and
a second processor coupled to the second memory and configured to
store a temperature correction value for correcting the preset temperature,
obtain first heater power applied to the heater, the first heater power being included in log information that is generated when the deposition process is performed,
predict second heater power by adding, to the first heater power, a first variation of heater power due to a preset temperature change and a second variation of heater power due to an accumulated film thickness change, and
correct the temperature correction value based on the predicted second heater power, wherein

the second processor is further configured to calculate the second variation of the heater power due to the accumulated film thickness change by using a model, in which a temperature variation is associated with a film thickness variation, and using an accumulated film thickness versus power table in which an accumulated film thickness variation is associated with a heater power variation.

2. The system according to claim 1 , wherein the second processor is configured to calculate the first variation of the heater power due to the preset temperature change by using the temperature correction value and using a temperature versus power table in which a temperature variation is associated with a heater power variation, the temperature correction value being used in the deposition process and being associated with the accumulated film thickness.

3. The system according to claim 2 ,
wherein the semiconductor manufacturing apparatus includes a reaction tube that is divided into zones,
wherein the temperature versus power table has a column for heater power variations for each of the zones, and a row for heater power variations for each of the zones, the temperature versus power table further including a temperature correction table having a temperature correction value for each of the zones, and
wherein the second processor is configured to calculate, for each of the zones, the first variation of the heater power due to the preset temperature change, by adding values in a row direction of the temperature versus power table for each of the zones, the values being obtained by multiplying the heater power variations in the column by the temperature correction value.

4. The system according to claim 1 ,
wherein the semiconductor manufacturing apparatus includes a reaction tube that is divided into zones,
wherein the model has a film thickness variation for each of the zones, and the accumulated film thickness versus power table has a heater power variation for each of the zones, the heater power variation being associated with the accumulated film thickness, and
wherein the second processor is configured to calculate, for each of the zones, the second variation of the heater power due to the accumulated film thickness change by multiplying the heater power variation by the film thickness variation for each of the zones.

5. The system according to claim 1 , wherein the second processor is configured to predict the second heater power on a per-zone basis and on a per-accumulated-film-thickness basis.

6. A temperature correction information calculating method performed by a temperature correction information calculating device for use with a semiconductor manufacturing apparatus, the temperature correction information calculating method comprising:
correcting a preset temperature in accordance with an accumulated film thickness on an inner wall of the semiconductor manufacturing apparatus;
controlling a temperature by using a heater such that the temperature approaches the corrected preset temperature in the semiconductor manufacturing apparatus to perform a deposition process on an object;
obtaining first heater power applied to the heater, the first heater power being included in log information that is generated when the deposition process is performed;
predicting second heater power by adding, to the first heater power, a first variation of heater power due to a preset temperature change and a second variation of heater power due to an accumulated film thickness change; and
correcting a temperature correction value based on the predicted second heater power, the temperature correction value being stored in a memory, wherein
the second variation of the heater power due to the accumulated film thickness change is calculated by using a model, in which a temperature variation is associated with a film thickness variation, and using an accumulated film thickness versus power table in which an accumulated film thickness variation is associated with a heater power variation.

7. A non-transitory recording medium storing a program for causing a temperature correction information calculating device for use with a semiconductor manufacturing apparatus to execute a process, the process comprising:
correcting a preset temperature in accordance with an accumulated film thickness on an inner wall of the semiconductor manufacturing apparatus;
controlling a temperature by using a heater such that the temperature approaches the corrected preset temperature in the semiconductor manufacturing apparatus to perform a deposition process on an object;
obtaining first heater power applied to the heater, the first heater power being included in log information that is generated when the deposition process is performed;
predicting second heater power by adding, to the first heater power, a first variation of heater power due to a preset temperature change and a second variation of heater power due to an accumulated film thickness change; and
correcting a temperature correction value based on the predicted second heater power, the temperature correction value being stored in a memory, wherein
the second variation of the heater power due to the accumulated film thickness change is calculated by using a model, in which a temperature variation is associated with a film thickness variation, and using an accumulated film thickness versus power table in which an accumulated film thickness variation is associated with a heater power variation.

Assignees

• Tokyo Electron Ltd

Inventors

• Watanabe Tatsuya
• Takenaga Yuichi

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title