Recipe optimization method and heat treatment apparatus

Patent metadata

Field	Value
Publication number	US-2025361618-A1
Application number	US-202519211708-A
Country	US
Kind code	A1
Filing date	May 19, 2025
Priority date	May 22, 2024
Publication date	Nov 27, 2025
Grant date	—

Abstract

A recipe optimization method includes: (a) generating a prediction model that predicts a process model representing a relationship between a temperature change amount and a film thickness change amount based on past evaluation data in a film formation process; (b) performing a preliminary film formation process on a substrate; (c) determining whether a film thickness of the substrate subjected to the film formation process is within an allowable range; (d) when determined that the film thickness is outside the allowable range, calculating a recipe of the preliminary film formation process based on the prediction model, performing the preliminary film formation process again using the recipe, and then returning to (c); and (e) when determined that the film thickness is within the allowable range, obtaining the recipe of the film formation process that is within the allowable range.

First claim

What is claimed is:

1 . A recipe optimization method comprising:
(a) generating a prediction model that predicts a process model representing a relationship between a temperature change amount and a film thickness change amount based on past evaluation data in a film formation process performed on a plurality of substrates accommodated in a processing container; (b) performing a preliminary film formation process on a substrate; (c) determining whether a film thickness of the substrate subjected to the film formation process is within an allowable range; (d) when determined in (c) that the film thickness is outside the allowable range, calculating a recipe of the preliminary film formation process based on the prediction model in (b), performing the preliminary film formation process again using the recipe, and then returning to (c); and (e) when determined in (c) that the film thickness is within the allowable range, obtaining the recipe of the film formation process that is within the allowable range.

2 . The recipe optimization method according to claim 1 , wherein in (d), the process model is generated based on the prediction model, and the recipe is optimized using the generated process model.

3 . The recipe optimization method according to claim 2 , wherein in (d), the process model serving as a target variable is generated by inputting a parameters of the preliminary film formation process as an explanatory variables along with the prediction model.

4 . The recipe optimization method according to claim 3 , wherein the parameters of the preliminary film formation process include the recipe of the preliminary film formation process having a target temperature of the substrates, a type, gas flow rate, and pressure of a processing gas, and hardware information of an apparatus.

5 . The recipe optimization method according to claim 2 , wherein when (d) is performed a plurality of times based on the determination in (c),
a prediction model is re-created by adding a result of the preliminary film formation process that is outside the allowable range, and a process model is generated based on the re-created prediction model.

6 . The recipe optimization method according to claim 1 , wherein the prediction model is calculated by a regression method using the past evaluation data of the film formation process performed in other apparatuses.

7 . The recipe optimization method according to claim 1 , in the film formation process, a processing gas is supplied to the plurality of substrates arranged in a vertical direction inside the processing container, and a temperature of the plurality of substrates is adjusted to a target temperature.

8 . A heat treatment apparatus comprising:
a processing container configured to accommodate a plurality of substrates; a gas supply configured to supply a processing gas into the processing container; a temperature regulating furnace configured to regulate a temperature of the plurality of substrates to a target temperature; and a controller configured to optimize a recipe of a film formation process performed on the plurality of substrates, and to control the gas supply and the temperature regulating furnace, wherein the controller controls
(a) generating a prediction model that predicts a process model representing a relationship between a temperature change amount and a film thickness change amount based on past evaluation data;
(b) performing a preliminary film formation process on a substrate;
(c) determining whether a film thickness of the substrate subjected to the film formation process is within an allowable range;
(d) when determined in (c) that the film thickness is outside the allowable range, calculating a recipe of the preliminary film formation process based on the prediction model in (b), performing the preliminary film formation process again using the recipe, and then returning to (c); and
(e) when determined in c) that the film thickness is within the allowable range, obtaining the recipe of the film formation process that is within the allowable range.

Assignees

• Tokyo Electron Ltd

Inventors

• Watanabe Tatsuya
• Takenaga Yuichi

Classifications

• C23C16/52 Primary

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/46 Primary

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10P72/06

  Apparatus for monitoring, sorting, marking, testing or measuring · CPC title

• C23C16/45563

  Gas nozzles · CPC title