Manufacturing a package using plateable encapsulant
US-11081417-B2 · Aug 3, 2021 · US
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See Beng Keh patents
See Beng Keh is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | See Beng Keh |
| Total patents | 7 |
| First publication | May 16, 2017 |
| Latest publication | Aug 3, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package with a through port for sensor applications
US-10549985-B2 · Feb 4, 2020 · US
Manufacturing a package using plateable encapsulant
US-2019341324-A1 · Nov 7, 2019 · US
Semiconductor package with plateable encapsulant and a method for manufacturing the same
US-10396007-B2 · Aug 27, 2019 · US
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
US-2018148322-A1 · May 31, 2018 · US
Manufacturing a package using plateable encapsulant
US-2017256472-A1 · Sep 7, 2017 · US
Chip arrangement and a method of manufacturing a chip arrangement
US-9653405-B2 · May 16, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W42/276 | 5 |
| H10W72/0198 | 5 |
| H10W74/019 | 5 |
| H10W74/01 | 5 |
| H10W42/20 | 5 |