Packaged semiconductor components having substantially rigid support members
US-10763185-B2 · Sep 1, 2020 · US
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Schwab Matt E patents
Schwab Matt E is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schwab Matt E |
| Total patents | 15 |
| First publication | Jan 22, 2015 |
| Latest publication | Sep 1, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-10692827-B2 · Jun 23, 2020 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-2019252281-A1 · Aug 15, 2019 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-10312173-B2 · Jun 4, 2019 · US
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-2019081015-A1 · Mar 14, 2019 · US
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-10163826-B2 · Dec 25, 2018 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-2018211896-A1 · Jul 26, 2018 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-9960094-B2 · May 1, 2018 · US
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-2018040582-A1 · Feb 8, 2018 · US
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-9812415-B2 · Nov 7, 2017 · US
Recent patents
Latest publications not already listed above.
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-2016254204-A1 · Sep 1, 2016 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-9362208-B2 · Jun 7, 2016 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-2015364403-A1 · Dec 17, 2015 · US
Packaged microdevices and methods for manufacturing packaged microdevices
US-8987885-B2 · Mar 24, 2015 · US
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US-2015021769-A1 · Jan 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 14 |
| H10W90/734 | 14 |
| H10W90/724 | 14 |
| H10W74/00 | 14 |
| H10W72/884 | 14 |