Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Patent metadata

Field	Value
Publication number	US-9960094-B2
Application number	US-201615141682-A
Country	US
Kind code	B2
Filing date	Apr 28, 2016
Priority date	Mar 13, 2007
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

First claim

We claim:

1. A packaged semiconductor component, comprising:
a semiconductor die having a first composition and a first surface;
an array of photo sensors at least partially embedded in the semiconductor die proximate to the first surface;
a support member attached to the semiconductor die, the support member being at least substantially rigid and having a second composition different from the first composition of the semiconductor die, the support member including a plurality of heat conducting fins;
a substrate carrying the semiconductor die and the support member attached to the semiconductor die; and
an encapsulant at least partially encasing the semiconductor die, the support member, and the substrate.

2. The packaged semiconductor component of claim 1 wherein the support member includes at least one of following: a slot, a channel, or an aperture.

3. The packaged semiconductor component of claim 1 wherein a thickness of the support member is about 100 microns to about 3 mm.

4. The packaged semiconductor component of claim 1 wherein the support member comprises a laminated structure having a plurality of different materials, wherein at least one of the different materials is substantially rigid.

5. The packaged semiconductor component of claim 1 , further comprising:
a glass member at the array of photo sensors.

6. A packaged semiconductor component, comprising:
a semiconductor die having a first composition and a first surface;
a photo sensor at least partially embedded in the semiconductor die proximate to the first surface;
a support member attached to the semiconductor die, the support member including a plate constructed from a metal and/or a metal alloy and having a second composition different from the first composition of the semiconductor die, the support member including a plurality of heat conducting fins;
a substrate carrying the semiconductor die and the attached support member; and
an encapsulant at least partially encasing the semiconductor die, the support member, and the substrate.

7. The packaged semiconductor component of claim 6 wherein the support member is constructed from a moldable material and at least partially encases the semiconductor die.

8. The packaged semiconductor component of claim 6 wherein the support member includes at least one of following: a slot, a channel, or an aperture.

9. The packaged semiconductor component of claim 6 wherein a thickness of the support member is about 100 microns to about 3 mm.

10. The packaged semiconductor component of claim 6 wherein the support member comprises a laminated structure having a plurality of different materials, wherein at least one of the different materials is substantially rigid.

11. The packaged semiconductor component of claim 6 , further comprising:
a glass member generally flush with the photo sensor at the first surface.

Assignees

• Micron Technology Inc

Inventors

• Schwab Matt E
• Brooks J Michael
• Corisis David J

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title