Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Patent metadata

Field	Value
Publication number	US-9812415-B2
Application number	US-201414506423-A
Country	US
Kind code	B2
Filing date	Oct 3, 2014
Priority date	Mar 13, 2007
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

First claim

We claim:

1. A method for mounting a semiconductor device to a circuit board, the method comprising:
depositing a plurality of pre-formed solder balls on at least a portion of a device attach region of the circuit board;
juxtaposing a back side of the semiconductor device and the pre-formed solder balls;
forming a generally rigid connection between the back side of the semiconductor device and the circuit board by contacting the pre-formed solder balls with a conductive layer and reflowing the pre-formed solder balls and conductive layer to form a single, unitary connection structure, wherein the conductive layer covers all of the back side of the semiconductor device: and
forming a plurality of wire bonds between terminals at a front side of the semiconductor device and corresponding contacts on the circuit board after forming the generally rigid connection between the semiconductor device and the circuit board.

2. The method of claim 1 wherein forming a generally rigid connection between the back side of the semiconductor device and the circuit board comprises attaching the semiconductor device to the circuit board in a chip-on-board (COB) configuration.

3. The method of claim 1 wherein depositing a plurality of pre-formed solder balls on at least a portion of a device attach area comprises depositing solder balls composed of at least one of a SnAgCu, SnAg, and SnAu solder material.

4. The method of claim 1 , further comprising depositing a non-conductive fill material in one or more interstitial spaces between the semiconductor device and the circuit board after forming the generally rigid connection.

5. The method of claim 1 , further comprising encapsulating the semiconductor device, the wire bonds, and at least a portion of the circuit board after forming the wire bonds.

6. The method of claim 1 wherein depositing a plurality of pre-formed solder balls on at least a portion of a device attach area comprises depositing solder balls composed of lead-free solder material.

7. The method of claim 1 , further comprising depositing a conductive layer on the back side of the semiconductor device, the conductive layer having a plurality of conductive pads arranged in a pattern corresponding at least in part to the arrangement of solder balls.

8. The method of claim 1 wherein forming a generally rigid connection between the back side of the semiconductor device and the circuit board comprises forming a connection structure that does not transmit signals between the semiconductor device and the circuit board.

Assignees

• Micron Technology Inc

Inventors

• Schwab Matt E
• Corisis David J
• Brooks J Michael

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title