Non-destructive coupon generation via direct write lithography for semiconductor process development
US-12566383-B2 · Mar 3, 2026 · US
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Schepis Anthony R patents
Schepis Anthony R is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schepis Anthony R |
| Total patents | 29 |
| First publication | Sep 23, 2021 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Coaxial see-through inspection system
US-12541155-B2 · Feb 3, 2026 · US
Method for chuck compensation via wafer shape control
US-12505998-B2 · Dec 23, 2025 · US
In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones
US-12455511-B2 · Oct 28, 2025 · US
Method of adjusting wafer shape using multi-directional actuation films
US-12394618-B2 · Aug 19, 2025 · US
Die shape control for die to wafer bond enhancement
US-2025259943-A1 · Aug 14, 2025 · US
Hybrid patterning-bonding semiconductor tool
US-12381093-B2 · Aug 5, 2025 · US
Wafer shape control for W2W bonding
US-12374562-B2 · Jul 29, 2025 · US
Method for creating product-like stressed surrogate test wafers
US-2025140614-A1 · May 1, 2025 · US
Precision multi-axis photolithography alignment correction using stressor film
US-12001147-B2 · Jun 4, 2024 · US
Recent patents
Latest publications not already listed above.
Cyclic self-limiting etch process
US-11791167-B2 · Oct 17, 2023 · US
Hybrid patterning-bonding semiconductor tool
US-2023326814-A1 · Oct 12, 2023 · US
Method for chuck compensation via wafer shape control
US-2023326738-A1 · Oct 12, 2023 · US
Wafer shape control for w2w bonding
US-2023326767-A1 · Oct 12, 2023 · US
Planarization of spin-on films
US-11776808-B2 · Oct 3, 2023 · US
In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones
US-2023251584-A1 · Aug 10, 2023 · US
Method to enhance lithography pattern creation using semiconductor stress film tuning
US-2023251574-A1 · Aug 10, 2023 · US
Localized stress regions for three-dimension chiplet formation
US-11721551-B2 · Aug 8, 2023 · US
Localized stress regions for three-dimension chiplet formation
US-11688642-B2 · Jun 27, 2023 · US
Precision multi-axis photolithography alignment correction using stressor film
US-2023161267-A1 · May 25, 2023 · US
Method of adjusting wafer shape using multi-directional actuation films
US-2023008350-A1 · Jan 12, 2023 · US
Coaxial see-through alignment imaging system
US-11526088-B2 · Dec 13, 2022 · US
Localized stress regions for three-dimension chiplet formation
US-2022238328-A1 · Jul 28, 2022 · US
Localized stress regions for three-dimension chiplet formation
US-2022238380-A1 · Jul 28, 2022 · US
Non-Destructive Coupon Generation via Direct Write Lithography for Semiconductor Process Development
US-2022113635-A1 · Apr 14, 2022 · US
Coaxial see-through inspection system
US-2022050386-A1 · Feb 17, 2022 · US
Coaxial see-through alignment imaging system
US-2022050388-A1 · Feb 17, 2022 · US
Cyclic Self-Limiting Etch Process
US-2021305060-A1 · Sep 30, 2021 · US
Planarization of Spin-On Films
US-2021296121-A1 · Sep 23, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 29 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P74/203 | 13 |
| H10P50/00 | 13 |
| H10P74/23 | 12 |
| H01L22/20 | 7 |
| H10P76/2041 | 6 |