Enhanced nozzle for disaggregated die handling during thermal compression bonding
US-2024213074-A1 · Jun 27, 2024 · US
Saltas Mark is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Saltas Mark |
| Total patents | 19 |
| First publication | Apr 5, 2018 |
| Latest publication | Jun 27, 2024 |
Publications ranked by popularity score, then publication date.
US-2024213074-A1 · Jun 27, 2024 · US
US-11156815-B2 · Oct 26, 2021 · US
US-11075166-B2 · Jul 27, 2021 · US
US-2020395301-A1 · Dec 17, 2020 · US
US-10790231-B2 · Sep 29, 2020 · US
US-2020073099-A1 · Mar 5, 2020 · US
US-10566134-B2 · Feb 18, 2020 · US
US-2019355666-A1 · Nov 21, 2019 · US
US-10418329-B2 · Sep 17, 2019 · US
US-2019202136-A1 · Jul 4, 2019 · US
Latest publications not already listed above.
US-10317952-B2 · Jun 11, 2019 · US
US-10315200-B2 · Jun 11, 2019 · US
US-2019006097-A1 · Jan 3, 2019 · US
US-2019002735-A1 · Jan 3, 2019 · US
US-2019001342-A1 · Jan 3, 2019 · US
US-2018337129-A1 · Nov 22, 2018 · US
US-10125013-B2 · Nov 13, 2018 · US
US-2018134547-A1 · May 17, 2018 · US
US-2018095503-A1 · Apr 5, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 19 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/07232 | 7 |
| H10W72/551 | 6 |
| H10W90/28 | 6 |
| H10W70/618 | 6 |
| H10W74/00 | 6 |