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Enhanced nozzle for disaggregated die handling during thermal compression bonding
US2024213074A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024213074-A1 |
| Application number | US-202218089468-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 27, 2022 |
| Priority date | Dec 27, 2022 |
| Publication date | Jun 27, 2024 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
This disclosure describes nozzle designs for holding disaggregated die flat in a bonding process. The nozzle designs may have trenches extending radially outward from the center of the nozzle to the corners, such as in a snowflake pattern. The trenches may be positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. The trenches may have a depth of at least 200 micrometers to allow for sufficient air flow to prevent warpage of the disaggregated die.
First claim
Opening claim text (preview).
What is claimed is: 1 . A nozzle for holding and keeping disaggregated die flat during bonding, the nozzle comprising: vacuum trenches configured to allow a flow of air associated with generating a vacuum suction for lifting disaggregated die, the vacuum trenches having a depth of at least 200 micrometers, wherein the vacuum trenches are positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. 2 . The nozzle of claim 1 , wherein a depth of the vacuum trenches is at least 250 micrometers. 3 . The nozzle of claim 1 , wherein a depth of the vacuum trenches is at least 500 micrometers. 4 . The nozzle of claim 1 , wherein the vacuum trenches extend radially from the center of the nozzle outward toward the corners of the nozzle. 5 . The nozzle of claim 4 , wherein the vacuum trenches do not reach the corners of the nozzle. 6 . The nozzle of claim 4 , wherein the vacuum trenches form a snowflake pattern. 7 . The nozzle of claim 4 , wherein the vacuum trenches are not in a rectangular pattern. 8 . The nozzle of claim 1 , wherein a width of the vacuum trenches is at least 250 micrometers. 9 . The nozzle of claim 1 , wherein a width of the vacuum trenches is at least 500 micrometers. 10 . A nozzle for holding and keeping disaggregated die flat during bonding, the nozzle comprising: vacuum trenches configured to allow a flow of air associated with generating a vacuum suction for lifting disaggregated die, wherein the vacuum trenches extend radially from the center of the nozzle outward toward the corners of the nozzle in a snowflake pattern. 11 . The nozzle of claim 10 , wherein a depth of the vacuum trenches is at least 250 micrometers. 12 . The nozzle of claim 10 , wherein a depth of the vacuum trenches is at least 500 micrometers. 13 . The nozzle of claim 10 , wherein the vacuum trenches are positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. 14 . The nozzle of claim 10 , wherein the vacuum trenches do not reach the corners of the nozzle. 15 . The nozzle of claim 10 , wherein a width of the vacuum trenches is at least 500 micrometers. 16 . A nozzle for holding and keeping disaggregated die flat during bonding, the nozzle comprising: vacuum trenches configured to allow a flow of air associated with generating a vacuum suction for lifting disaggregated die, wherein the vacuum trenches extend radially from the center of the nozzle outward toward the corners of the nozzle. 17 . The nozzle of claim 15 , wherein a depth of the vacuum trenches is at least 250 micrometers. 18 . The nozzle of claim 15 , wherein a depth of the vacuum trenches is at least 500 micrometers. 19 . The nozzle of claim 15 , wherein the vacuum trenches are positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. 20 . The nozzle of claim 15 , wherein the vacuum trenches do not reach the corners of the nozzle.
Assignees
Inventors
Classifications
Compression bonding, e.g. thermocompression bonding · CPC title
- H10P72/78Primary
using vacuum or suction, e.g. Bernoulli chucks · CPC title
with vacuum · CPC title
Electricity · mapped topic
- H01L21/6838Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2024213074A1 cover?
- This disclosure describes nozzle designs for holding disaggregated die flat in a bonding process. The nozzle designs may have trenches extending radially outward from the center of the nozzle to the corners, such as in a snowflake pattern. The trenches may be positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. The trenches may hav…
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 27 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).