Structures and methods for determining TDDB reliability at reduced spacings using the structures
US-9524916-B2 · Dec 20, 2016 · US
Materials of bond wires
Materials of bond wires · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/551 |
| Official title | {Materials of bond wires} |
| Display label | Materials of bond wires |
| Total patents | 1,588 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 58 |
| 2016 | 55 |
| 2017 | 129 |
| 2018 | 144 |
| 2019 | 137 |
| 2020 | 218 |
| 2021 | 236 |
| 2022 | 243 |
| 2023 | 146 |
| 2024 | 111 |
| 2025 | 98 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package having an isolation wall to reduce electromagnetic coupling
US-9450547-B2 · Sep 20, 2016 · US
Semiconductor device and method for manufacturing the semiconductor device
US-2015380368-A1 · Dec 31, 2015 · US
Implant device and method of making the same
US-2015371929-A1 · Dec 24, 2015 · US
Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure
US-9202794-B2 · Dec 1, 2015 · US
Method of forming a thin substrate chip scale package device and structure
US-2015332991-A1 · Nov 19, 2015 · US
Memory device comprising programmable command-and-address and/or data interfaces
US-2015332746-A1 · Nov 19, 2015 · US
Light emitting device having interstitial elements in grain boundaries of barrier layer
US-9178117-B2 · Nov 3, 2015 · US
Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
US-2015311131-A1 · Oct 29, 2015 · US
Wafer, package structure and method of manufacturing the same
US-2015311183-A1 · Oct 29, 2015 · US
Integrated circuit package including miniature antenna
US-2015303575-A1 · Oct 22, 2015 · US
Integrated electronic device with transceiving antenna and magnetic interconnection
US-2015294946-A1 · Oct 15, 2015 · US
Packaging Mechanisms for Dies with Different Sizes of Connectors
US-2015262898-A1 · Sep 17, 2015 · US
Semiconductor device
US-2015255369-A1 · Sep 10, 2015 · US
Method of forming a thin substrate chip scale package device and structure
US-9129975-B2 · Sep 8, 2015 · US
Memory device comprising programmable command-and-address and/or data interfaces
US-9117496-B2 · Aug 25, 2015 · US
Electronic array and chip package
US-9111772-B1 · Aug 18, 2015 · US
Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
US-2015223322-A1 · Aug 6, 2015 · US
Semiconductor device and manufacturing method thereof
US-2015221573-A1 · Aug 6, 2015 · US
Magnetically coupled galvanically isolated communication using lead frame
US-2015221583-A1 · Aug 6, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/551?
- CPC H10W72/551 is the Cooperative Patent Classification code for “Materials of bond wires.”
- How many patents are filed under CPC H10W72/551 (Materials of bond wires)?
- Our database includes 1,588 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/551 growing?
- Publication counts under this code: 111 in 2024 vs 98 in 2025 (latest complete years).