Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
US-10173893-B2 · Jan 8, 2019 · US
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Quevy Emmanuel P patents
Quevy Emmanuel P is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Quevy Emmanuel P |
| Total patents | 20 |
| First publication | Jan 8, 2015 |
| Latest publication | Jan 8, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
US-10118820-B2 · Nov 6, 2018 · US
Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
US-9988265-B2 · Jun 5, 2018 · US
Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
US-2017197822-A1 · Jul 13, 2017 · US
Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
US-9637371-B2 · May 2, 2017 · US
Temperature compensation for MEMS devices
US-9602026-B2 · Mar 21, 2017 · US
Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
US-9428377-B2 · Aug 30, 2016 · US
Method for temperature compensation in MEMS resonators with isolated regions of distinct material
US-9422157-B2 · Aug 23, 2016 · US
Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
US-9422149-B2 · Aug 23, 2016 · US
Monolithic body MEMS devices
US-9300227-B2 · Mar 29, 2016 · US
Recent patents
Latest publications not already listed above.
Technique for forming a MEMS device
US-9260290-B2 · Feb 16, 2016 · US
Methods And Structures For Thin-Film Encapsulation And Co-Integration Of Same With Microelectronic Devices and Microelectromechanical Systems (MEMS)
US-2016023888-A1 · Jan 28, 2016 · US
Trapped Sacrificial Structures And Methods Of Manufacturing Same Using Thin-Film Encapsulation
US-2016025664-A1 · Jan 28, 2016 · US
Membrane Transducer Structures And Methods Of Manufacturing Same Using Thin-Film Encapsulation
US-2016023889-A1 · Jan 28, 2016 · US
Suspended passive element for MEMS devices
US-9246412-B2 · Jan 26, 2016 · US
Method for temperature compensation in mems resonators with isolated regions of distinct material
US-2015266724-A1 · Sep 24, 2015 · US
Gas-diffusion barriers for MEMS encapsulation
US-9018715-B2 · Apr 28, 2015 · US
Integrated MEMS design for manufacturing
US-9007119-B2 · Apr 14, 2015 · US
Compensation of changes in MEMS capacitive transduction
US-9000833-B2 · Apr 7, 2015 · US
Technique for forming a mems device
US-2015008545-A1 · Jan 8, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Silicon Lab Inc | 13 |
| Semiconductor Mfg Int Shanghai Corp | 8 |
| Semiconductor Mfg International Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0235 | 12 |
| B81B7/008 | 12 |
| B81C1/00246 | 12 |
| B81C2203/0735 | 12 |
| B81C1/00285 | 10 |