Temperature compensation for MEMS devices

Patent metadata

Field	Value
Publication number	US-9602026-B2
Application number	US-201314029927-A
Country	US
Kind code	B2
Filing date	Sep 18, 2013
Priority date	Jun 5, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A microelectromechanical system (MEMS) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first Young's modulus temperature coefficient. The second beam is formed from a second material having a second Young's modulus temperature coefficient. The body may include a routing spring suspended from the substrate. The routing spring may be coupled to the first beam and the second beam. The routing spring may be formed from the second material. The first beam and the second beam may have lower spring compliance than the routing spring. The MEMS device may be a resonator and the temperature compensating structure may have dimensions and a location such that the temperature compensation structure modifies a temperature coefficient of frequency of the resonator independent of a mode shape of the resonator.

First claim

What is claimed is:

1. An apparatus comprising:
a microelectromechanical system (MEMS) device comprising:
a first electrode and a second electrode; and
a body suspended from a substrate, the body and the first electrode forming a first electrostatic transducer, and the body and the second electrode forming a second electrostatic transducer, wherein the body comprises:
a temperature compensating structure comprising:
a first beam suspended from the substrate, the first beam being formed from a first material having a first Young's modulus temperature coefficient;
a second beam suspended from the substrate, the second beam being formed from a second material having a second Young's modulus temperature coefficient; and
a routing spring suspended from the substrate, the routing spring being coupled to the first beam and the second beam.

2. The apparatus, as recited in claim 1 , wherein the second material has a higher electrical conductivity than the first material.

3. The apparatus, as recited in claim 1 , wherein the first beam and the second beam are mechanically coupled in series.

4. The apparatus, as recited in claim 1 , wherein:
the routing spring is formed from the second material.

5. The apparatus, as recited in claim 1 , wherein the routing spring has a serpentine structure.

6. The apparatus, as recited in claim 1 , wherein a first electrical conductivity of the routing spring dominates a second electrical conductivity of the temperature compensating structure.

7. The apparatus, as recited in claim 1 , wherein the first beam and the second beam have lower spring compliance than the routing spring.

8. The apparatus, as recited in claim 1 , wherein a first mechanical behavior of the first beam and the second beam dominates a second mechanical behavior of the temperature compensating structure.

9. The apparatus, as recited in claim 1 , wherein the first Young's modulus temperature coefficient is positive and the second Young's modulus temperature coefficient is negative.

10. An apparatus comprising:
a microelectromechanical system (MEMS) device comprising:
a first electrode and a second electrode; and
a body suspended from a substrate, the body and the first electrode forming a first electrostatic transducer, and the body and the second electrode forming a second electrostatic transducer, wherein the body comprises:
a temperature compensating structure comprising:
a first beam suspended from the substrate, the first beam being formed from a first material having a first Young's modulus temperature coefficient; and
a second beam suspended from the substrate, the second beam being formed from a second material having a second Young's modulus temperature coefficient,

wherein the MEMS device is a resonator and the temperature compensating structure has dimensions and a location such that the temperature compensating structure modifies a temperature coefficient of frequency of the resonator independent of a mode shape of the resonator.

Assignees

• Silicon Lab Inc

Inventors

• Quevy Emmanuel P
• Koury Jr Daniel N

Classifications

• H03H2009/02291

  Beams · CPC title

• H02N1/00 Primary

  Electrostatic generators or motors using a solid moving electrostatic charge carrier · CPC title

• H03L1/02

  against variations of temperature only · CPC title

• H03H2009/0248

  Strain · CPC title

• H03L1/04

  Constructional details for maintaining temperature constant · CPC title