Physical vapor deposition chamber with target surface morphology monitor
US-2026049391-A1 · Feb 19, 2026 · US
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Pan Shing-Chyang patents
Pan Shing-Chyang is listed as an inventor on 82 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pan Shing-Chyang |
| Total patents | 82 |
| First publication | Jun 11, 2015 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing a semiconductor device
US-12557572-B2 · Feb 17, 2026 · US
Physical vapor deposition chamber with target surface morphology monitor
US-12486566-B2 · Dec 2, 2025 · US
Etch stop layer for semiconductor devices
US-12451393-B2 · Oct 21, 2025 · US
Diffusion barrier layer in programmable metallization cell
US-12245529-B2 · Mar 4, 2025 · US
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
US-12151932-B2 · Nov 26, 2024 · US
Patterning methods for semiconductor devices
US-12074058-B2 · Aug 27, 2024 · US
Method for manufacturing a semiconductor device
US-2024282571-A1 · Aug 22, 2024 · US
Memory device and method for fabricating the same
US-11991930-B2 · May 21, 2024 · US
Diffusion barrier layer in programmable metallization cell
US-2023413696-A1 · Dec 21, 2023 · US
Recent patents
Latest publications not already listed above.
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
US-2023382712-A1 · Nov 30, 2023 · US
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
US-11814283-B2 · Nov 14, 2023 · US
Diffusion barrier layer in programmable metallization cell
US-11778931-B2 · Oct 3, 2023 · US
Metal-based etch-stop layer
US-11769693-B2 · Sep 26, 2023 · US
Structure for microelectromechanical systems (mems) devices to control pressure at high temperature
US-2023294978-A1 · Sep 21, 2023 · US
Patterning methods for semiconductor devices
US-2023260829-A1 · Aug 17, 2023 · US
Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
US-11697588-B2 · Jul 11, 2023 · US
Patterning methods for semiconductor devices
US-11676852-B2 · Jun 13, 2023 · US
Etch stop layer for semiconductor devices
US-11651993-B2 · May 16, 2023 · US
Memory device and method for fabricating the same
US-2023073308-A1 · Mar 9, 2023 · US
Diffusion barrier layer in programmable metallization cell
US-11594678-B2 · Feb 28, 2023 · US
Memory device and method for fabricating the same
US-11515474-B2 · Nov 29, 2022 · US
Diffusion barrier layer in programmable metallization cell
US-2022367801-A1 · Nov 17, 2022 · US
Physical vapor deposition chamber with target surface morphology monitor
US-2022349045-A1 · Nov 3, 2022 · US
Physical vapor deposition chamber with target surface morphology monitor
US-11479849-B2 · Oct 25, 2022 · US
Etch Stop Layer for Semiconductor Devices
US-2022254680-A1 · Aug 11, 2022 · US
Etch stop layer for semiconductor devices
US-11322396-B2 · May 3, 2022 · US
Structure for microelectromechanical systems (mems) devices to control pressure at high temperature
US-2022089434-A1 · Mar 24, 2022 · US
Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
US-11198606-B2 · Dec 14, 2021 · US
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
US-2021309508-A1 · Oct 7, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 85 |
| Ko Chung Chi | 1 |
| Chou Chia Cheng | 1 |
| Pan Shing Chyang | 1 |
| Lin Keng Chu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/081 | 32 |
| H10W20/089 | 28 |
| H10P50/73 | 25 |
| H01L21/76802 | 23 |
| H10W20/056 | 21 |