Multilayer electronic component
US-12444541-B2 · Oct 14, 2025 · US
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Okada Hiroki patents
Okada Hiroki is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Okada Hiroki |
| Total patents | 15 |
| First publication | Jul 8, 2021 |
| Latest publication | Oct 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of manufacturing printed circuit board
US-12426165-B2 · Sep 23, 2025 · US
Multilayer electronic component having external electrode including alloy layer between base electrode layer and plating layer
US-12400795-B2 · Aug 26, 2025 · US
Multilayer electronic component
US-12272497-B2 · Apr 8, 2025 · US
Multilayer electronic component
US-2024331946-A1 · Oct 3, 2024 · US
Multilayer electronic component
US-2024312714-A1 · Sep 19, 2024 · US
Method of manufacturing printed circuit board
US-2024298411-A1 · Sep 5, 2024 · US
Multilayer electronic component
US-2024212935-A1 · Jun 27, 2024 · US
Multilayer electronic component
US-2024212936-A1 · Jun 27, 2024 · US
Method of manufacturing printed circuit board
US-12016130-B2 · Jun 18, 2024 · US
Recent patents
Latest publications not already listed above.
Printed circuit board
US-11770894-B2 · Sep 26, 2023 · US
Method of manufacturing printed circuit board
US-2022386473-A1 · Dec 1, 2022 · US
Printed circuit board
US-2022030704-A1 · Jan 27, 2022 · US
Printed circuit board
US-11122679-B2 · Sep 14, 2021 · US
Printed circuit board
US-2021212198-A1 · Jul 8, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/2325 | 7 |
| H01G4/30 | 7 |
| H01G4/012 | 7 |
| H01G4/1227 | 7 |
| H01G4/232 | 7 |