Multilayer electronic component

US12444541B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12444541-B2
Application numberUS-202318235064-A
CountryUS
Kind codeB2
Filing dateAug 17, 2023
Priority dateMar 31, 2023
Publication dateOct 14, 2025
Grant dateOct 14, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer electronic component, comprising: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein a lattice-type groove shape having a plurality of grooves arranged in a lattice form is formed in at least a portion of a surface of the body, and when a maximum length of the lattice-type groove shape is defined as L based on a plan view, L≤10 μm is satisfied. 2. The multilayer electronic component of claim 1 , wherein the lattice-type groove shape comprises an outer wall and the groove surrounded by the outer wall, and the groove has a shape in which a width thereof decreases in an inner direction of the body. 3. The multilayer electronic component of claim 1 , wherein the lattice-type groove shape comprises at least one of a waffle shape, a wave shape, or a dome shape. 4. The multilayer electronic component of claim 1 , wherein when a ten-point average surface roughness of the groove is defined as R2z, R2z≥3 μm is satisfied. 5. The multilayer electronic component of claim 1 , wherein when an area of the lattice-type groove shape is defined as A based on a plan view, A≤0.5×L 2 is satisfied. 6. The multilayer electronic component of claim 1 , wherein the lattice-type groove shape is formed in at least a portion of the surface of the body in contact with the external electrode. 7. The multilayer electronic component of claim 6 , wherein an area in which the lattice-type groove shape is formed is 10% or more compared to an area of the surface of the body in contact with the external electrode. 8. The multilayer electronic component of claim 6 , wherein the lattice-type groove shape is further formed on the surface of the body in which the external electrode is not disposed. 9. The multilayer electronic component of claim 1 , wherein the body comprises a capacitance formation portion including the dielectric layer and the internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and a cover portion respectively disposed on both end surfaces of the capacitance formation portion in the first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a side margin portion respectively disposed on the fifth and sixth surfaces of the body. 10. The multilayer electronic component of claim 9 , wherein the internal electrode comprises a first internal electrode in contact with the third surface of the body and a second internal electrode in contact with the fourth surface of the body, and the lattice-type groove shape is not formed on one side surface of the first internal electrode in contact with the third surface of the body and one side surface of the second internal electrode in contact with the fourth surface of the body. 11. The multilayer electronic component of claim 9 , wherein the lattice-type groove shape is further formed in at least a portion of an external surface of the side margin portion. 12. The multilayer electronic component of claim 1 , wherein the external electrode comprises an electrode layer disposed on the body and connected to the internal electrode, and an average thickness of the electrode layer is 1 μm or less. 13. The multilayer electronic component of claim 12 , wherein the electrode layer comprises copper (Cu). 14. The multilayer electronic component of claim 12 , wherein the external electrode further comprises a plating layer disposed on the electrode layer, and the plating layer comprises at least one of a copper (Cu) plating layer, a nickel (Ni) plating layer, or a tin (Sn) plating layer. 15. The multilayer electronic component of claim 14 , wherein the plating layer is disposed in an order of the copper (Cu) plating layer, the nickel (Ni) plating layer, and the tin (Sn) plating layer. 16. A multilayer electronic component, comprising: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein at least a portion of a surface of the body that is covered by the external electrode has a repetitive pattern shaped by a plurality of grooves forming a plurality of areas, each area being surrounded by the grooves, and when a maximum length of repetitive pattern is defined as L based on a plan view, L≤10 μm is satisfied. 17. The multilayer electronic component of claim 16 , wherein an area in which the repetitive pattern is formed is 10% or more compared to an area of the surface of the body in contact with the external electrode. 18. The multilayer electronic component of claim 16 , wherein when a ten-point average surface roughness of the repetitive pattern is defined as R2z, R2z≥3 μm is satisfied. 19. A multilayer electronic component, comprising: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein a lattice-type groove shape having a plurality of grooves arranged in a lattice form is formed in at least a portion of a surface of the body, and when a maximum length of the lattice-type groove shape is defined as L, an area of the lattice-type groove shape is defined as A based on a plan view, A≤0.5×L 2 is satisfied. 20. The multilayer electronic component of claim 19 , wherein the lattice-type groove shape comprises an outer wall and the groove surrounded by the outer wall, and the groove has a shape in which a width thereof decreases in an inner direction of the body. 21. The multilayer electronic component of claim 19 , wherein the lattice-type groove shape comprises at least one of a waffle shape, a wave shape, or a dome shape. 22. The multilayer electronic component of claim 19 , wherein when a ten-point average surface roughness of the groove is defined as R2z, R2z≥3 μm is satisfied.

Assignees

Inventors

Classifications

  • Form of non-self-supporting electrodes · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

  • Selection of materials · CPC title

  • based on barium titanates · CPC title

  • based on alkaline earth titanates · CPC title

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What does patent US12444541B2 cover?
A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 14 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).