Printed circuit board

Patent metadata

Field	Value
Publication number	US-11770894-B2
Application number	US-202117224615-A
Country	US
Kind code	B2
Filing date	Apr 7, 2021
Priority date	Jul 22, 2020
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.

First claim

What is claimed is:

1. A printed circuit board, comprising:
a rigid region and a flexible region;
a first substrate disposed on the rigid region and the flexible region, the first substrate comprising a first insulating layer comprising a first groove in the flexible region, and a first wiring layer; and
a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.

2. The printed circuit board of claim 1 , wherein the first groove is disposed adjacent to an interface between the rigid region and the flexible region.

3. The printed circuit board of claim 1 , wherein the first groove is disposed in one surface of the first insulating layer, the one surface of the first insulating layer facing the second substrate.

4. The printed circuit board of claim 3 , wherein the first insulating layer further comprises a second groove disposed in the one surface of the insulating layer in the rigid region.

5. The printed circuit board of claim 4 , wherein the first adhesive layer is disposed between the first and second insulating layers and disposed in at least a portion of the second groove.

6. The printed circuit board of claim 5 , wherein the second insulating layer comprises a third groove disposed in a surface of the second insulating layer opposite to one surface of the second insulating layer, the one surface of the second insulating layer facing the first substrate.

7. The printed circuit board of claim 6 , wherein the adhesive layer, the second insulating layer and the second wiring layer include a plurality of adhesive layers, second insulating layers and wiring layers, respectively,
wherein a plurality of the second insulating layers are disposed on a plurality of the first adhesive layers, respectively
a plurality of the second wiring layers are disposed on a plurality of the second insulating layers, respectively, and
the third groove is disposed in any one of the plurality of the second insulating layers.

8. The printed circuit board of claim 7 , wherein any one of the plurality of the first adhesive layers is disposed between two of the plurality of the second insulating layers and is disposed in at least a portion of the third groove.

9. The printed circuit board of claim 3 , wherein the first insulating layer in the flexible region further comprises a second groove disposed in a surface of the first insulating layer opposite to the one surface comprising the first groove, and
at least a portion of the first groove and at least a portion of the second groove are recessed toward each other.

10. The printed circuit board of claim 1 , wherein the adhesive layer is thinner than the second insulating layer.

11. The printed circuit board of claim 1 , wherein the first insulating layer includes a plurality of the first insulating layers, and
the first substrate further comprises a second adhesive layer disposed between the plurality of the first insulating layers.

12. The printed circuit board of claim 1 , wherein the first wiring layer is disposed on the first insulating layer,
the first adhesive layer is disposed on the first insulating layer to cover at least a portion of the first wiring layer,
the second insulating layer is disposed on the first adhesive layer, and
the second wiring layer is disposed on the second insulating layer.

13. The printed circuit board of claim 12 , wherein the second substrate further comprises a via penetrating through the first adhesive layer and the second insulating layer to connect the first wiring layer and the second wiring layer,
wherein the via and the second wiring layer are integrated.

14. The printed circuit board of claim 1 , wherein the first groove is disposed on an interface between the rigid region and the flexible region.

15. The printed circuit board of claim 1 , wherein a material included in the first adhesive layer extends from the first adhesive layer to be disposed in at least a portion of the first groove.

16. A printed circuit board, comprising:
a first insulating layer including a first groove;
a first wiring layer disposed on the first insulating layer, and including a pattern disposed on one side of the first groove;
a second insulating layer disposed on the one side of the first groove to cover the pattern;
a third insulating layer disposed on the second insulating layer; and
a second wiring layer disposed on the third insulating layer and connected to the first wiring layer,
wherein a portion of the first insulating layer disposed on another side of the groove is exposed from the second insulating layer and the third insulating layer, and
a material included the second insulating layer extends from the second insulating layer to be disposed in at least a portion of the first groove.

17. The printed circuit board of claim 16 , wherein the second insulting layer includes a material different from the first insulating layer and the third insulating layer.

18. The printed circuit board of claim 16 , wherein the first insulating layer further comprises a second groove on the one side of the first groove, and
a portion of the second insulating layer is disposed in the second groove.

19. The printed circuit board of claim 16 , wherein the first insulating layer includes a third groove, and
the first groove and the third groove are disposed on opposing surfaces of the first insulating layer and recessed toward each other in a stack direction of the second insulating layer and the third insulating layer.

20. The printed circuit board of claim 16 , wherein the first wiring layer and the second wiring layer are disposed on opposing surfaces of the third insulating layer.

Assignees

• Samsung Electro Mech

Inventors

• Okada Hiroki

Classifications

• H05K1/0278 Primary

  Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K1/0313

  Organic insulating material · CPC title