Semiconductor Devices and Methods for Manufacturing Thereof
US-2026090407-A1 · Mar 26, 2026 · US
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Ng Chee Yang patents
Ng Chee Yang is listed as an inventor on 55 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ng Chee Yang |
| Total patents | 55 |
| First publication | Jan 29, 2015 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Circuit with counterrotational circuit paths
US-2026066893-A1 · Mar 5, 2026 · US
Package with carrier having component on pad on one side and other pad with two metallic areas on other side
US-2026053027-A1 · Feb 19, 2026 · US
Hybrid embedded package
US-12412797-B2 · Sep 9, 2025 · US
Package with Vertical Electronic Components Held Together by a Clip
US-2025062273-A1 · Feb 20, 2025 · US
Dipped coated electronic module assembly with enhanced thermal distribution
US-12232302-B2 · Feb 18, 2025 · US
Method for fabricating topside cooled semiconductor packages by film assisted molding and a semiconductor package
US-2025054831-A1 · Feb 13, 2025 · US
Power module with inductor-cooled power stage
US-2025048531-A1 · Feb 6, 2025 · US
Method of forming a chip package and method of forming a semiconductor arrangement
US-2025022768-A1 · Jan 16, 2025 · US
Voltage regulator module with inductor-cooled power stage
US-12150236-B2 · Nov 19, 2024 · US
Recent patents
Latest publications not already listed above.
Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement
US-12136583-B2 · Nov 5, 2024 · US
Stacked transistor chip package with source coupling
US-12094807-B2 · Sep 17, 2024 · US
Solder structure with disruptable coating as solder spreading protection
US-2024274563-A1 · Aug 15, 2024 · US
Dipped coated electronic module assembly with enhanced thermal distribution
US-2024215208-A1 · Jun 27, 2024 · US
Package for a lateral power transistor
US-2024162136-A1 · May 16, 2024 · US
Semiconductor package having a chip carrier with a pad offset feature
US-11984392-B2 · May 14, 2024 · US
Voltage regulator module with inductor-cooled power stage
US-2023371165-A1 · Nov 16, 2023 · US
Manufacturing package by solderable or sinterable metallic connection structure applied on sacrificial carrier
US-2023335516-A1 · Oct 19, 2023 · US
Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
US-11676879-B2 · Jun 13, 2023 · US
Hybrid Embedded Package
US-2023052437-A1 · Feb 16, 2023 · US
Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures
US-2023027669-A1 · Jan 26, 2023 · US
Hybrid embedded package
US-11521907-B2 · Dec 6, 2022 · US
Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation
US-11393743-B2 · Jul 19, 2022 · US
Method of Forming a Chip Package, Method of Forming a Semiconductor Arrangement, Chip Package, and Semiconductor Arrangement
US-2022139798-A1 · May 5, 2022 · US
Stacked transistor chip package with source coupling
US-2022122906-A1 · Apr 21, 2022 · US
Hybrid Embedded Package
US-2022115287-A1 · Apr 14, 2022 · US
Semiconductor package having a chip carrier with a pad offset feature
US-2022102263-A1 · Mar 31, 2022 · US
Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
US-2022102235-A1 · Mar 31, 2022 · US
Semiconductor package having a laser-activatable mold compound
US-11289436-B2 · Mar 29, 2022 · US
Over-under sensor packaging with sensor spaced apart from control chip
US-11174152-B2 · Nov 16, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 45 |
| Infineon Technologies Austria Ag | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/114 | 20 |
| H10W70/65 | 17 |
| H10W90/00 | 17 |
| H10W90/701 | 14 |
| H10W70/635 | 14 |