Semiconductor package having a high reliability
US-12183718-B2 · Dec 31, 2024 · US
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NAM Geol patents
NAM Geol is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | NAM Geol |
| Total patents | 28 |
| First publication | Aug 24, 2017 |
| Latest publication | Dec 31, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package having a high reliability
US-2024145437-A1 · May 2, 2024 · US
Semiconductor package having a high reliability
US-11894346-B2 · Feb 6, 2024 · US
Semiconductor package
US-11848274-B2 · Dec 19, 2023 · US
Semiconductor package including mold layer having curved cross-section shape
US-11705430-B2 · Jul 18, 2023 · US
Semiconductor package having a high reliability
US-2023207533-A1 · Jun 29, 2023 · US
Semiconductor package having a high reliability
US-11664352-B2 · May 30, 2023 · US
Semiconductor package
US-2022344271-A1 · Oct 27, 2022 · US
Semiconductor package
US-11462479-B2 · Oct 4, 2022 · US
Semiconductor package
US-2022246582-A1 · Aug 4, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor package
US-11393764-B2 · Jul 19, 2022 · US
Semiconductor package having a high reliability
US-2021280564-A1 · Sep 9, 2021 · US
Semiconductor package and method of manufacturing the same
US-2021183821-A1 · Jun 17, 2021 · US
Semiconductor package
US-2021159178-A1 · May 27, 2021 · US
Semiconductor package having a high reliability
US-11018115-B2 · May 25, 2021 · US
Semiconductor package and method of manufacturing the same
US-10964670-B2 · Mar 30, 2021 · US
Semiconductor package having a high reliability
US-2020219853-A1 · Jul 9, 2020 · US
Semiconductor packages
US-10651154-B2 · May 12, 2020 · US
Semiconductor package having a high reliability
US-10622335-B2 · Apr 14, 2020 · US
Semiconductor package
US-2019378797-A1 · Dec 12, 2019 · US
Semiconductor package
US-10431547-B2 · Oct 1, 2019 · US
Semiconductor package and method of manufacturing the same
US-2019229091-A1 · Jul 25, 2019 · US
Semiconductor package having a high reliability
US-2019096856-A1 · Mar 28, 2019 · US
Semiconductor package
US-2019013272-A1 · Jan 10, 2019 · US
Semiconductor package having a high reliability
US-10153255-B2 · Dec 11, 2018 · US
Semiconductor packages
US-2018331076-A1 · Nov 15, 2018 · US
Semiconductor packages
US-10090278-B2 · Oct 2, 2018 · US
Semiconductor package having a high reliability
US-2017243857-A1 · Aug 24, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 28 |
| Park Sang Sick | 1 |
| NAM Geol | 1 |
| Min Tae Hong | 1 |
| Hwang Jihwan | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/722 | 28 |
| H10W90/297 | 28 |
| H10W90/00 | 28 |
| H01L25/0657 | 28 |
| H10W90/724 | 24 |