Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device
US-2026043611-A1 · Feb 12, 2026 · US
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Nakashima Seiyo patents
Nakashima Seiyo is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nakashima Seiyo |
| Total patents | 17 |
| First publication | Sep 24, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device
US-12467689-B2 · Nov 11, 2025 · US
Substrate processing apparatus, process vessel, method of manufacturing semiconductor device and non-transitory tangible medium
US-12338529-B2 · Jun 24, 2025 · US
Substrate processing apparatus
US-12018373-B2 · Jun 25, 2024 · US
Substrate processing apparatus, substrate holder, method of manufacturing semiconductor device, and recording medium
US-2023343614-A1 · Oct 26, 2023 · US
Separator of substrate processing apparatus
US-D982537-S · Apr 4, 2023 · US
Substrate processing apparatus, process vessel, method of manufacturing semiconductor device and non-transitory tangible medium
US-2023096080-A1 · Mar 30, 2023 · US
Adiabatic plate for substrate processing appratus
US-D981972-S · Mar 28, 2023 · US
Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device
US-2023089509-A1 · Mar 23, 2023 · US
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-10825697-B2 · Nov 3, 2020 · US
Recent patents
Latest publications not already listed above.
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-2020303219-A1 · Sep 24, 2020 · US
Substrate processing apparatus
US-2020291516-A1 · Sep 17, 2020 · US
Substrate processing apparatus, exhaust system and method of manufacturing semiconductor device
US-10163663-B2 · Dec 25, 2018 · US
Substrate processing apparatus, exhaust system and method of manufacturing semiconductor device
US-2018144953-A1 · May 24, 2018 · US
Substrate processing apparatus
US-9698037-B2 · Jul 4, 2017 · US
Substrate processing apparatus
US-9394607-B2 · Jul 19, 2016 · US
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
US-2015267296-A1 · Sep 24, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kokusai Electric Corp | 13 |
| Hitachi Int Electric Inc | 5 |
| Nakashima Seiyo | 1 |
| Matsuda Yuichi | 1 |
| Nogami Takashi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0431 | 12 |
| H10P72/0402 | 10 |
| H10P72/0602 | 8 |
| H10P72/12 | 7 |
| H10P14/6334 | 6 |