Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12018373-B2
Application number	US-202016812432-A
Country	US
Kind code	B2
Filing date	Mar 9, 2020
Priority date	Mar 14, 2019
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

There is provided a technique that includes: a substrate transfer chamber; a pod transfer chamber; a plurality of reinforcement structures installed along a wall of a housing constituting the substrate transfer chamber and forming a plurality of first confinement spaces between the reinforcement structures and the wall; a communication hole installed at each of the plurality of reinforcement structures so that a space in the housing and each of the plurality of first confinement spaces communicate with each other; a collecting pipe having the plurality of reinforcement structures connected in the housing and including a second confinement space communicating with the plurality of first confinement spaces; and a pressure regulator connected to the collecting pipe, and configured to perform a regulation so that a relationship of pressure is satisfied.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a process chamber in which a substrate mounted on a boat is processed;
a substrate transfer chamber configured to transfer the substrate to the boat;
a pod transfer chamber adjacent to the substrate transfer chamber;
a transfer chamber system exhaust part installed at the pod transfer chamber, and configured to actively exhaust an internal atmosphere of the pod transfer chamber;
a plurality of reinforcement structures, which are U-shaped beams, installed along a wall of a housing, which constitutes the substrate transfer chamber, whereby a confinement space is formed between each of the plurality of reinforcement structures and the wall;
a communication hole installed at each of the plurality of reinforcement structures so that a space in the housing and the first confinement space communicate with each other;
a collecting pipe connected to the plurality of reinforcement structures in the housing and including a second confinement space that communicates with the first confinement space and extends toward the pod transfer chamber;
an inert gas supply part comprising a fan and a dustproof filter configured to supply an inert gas into the housing constituting the substrate transfer chamber; and
a pressure regulator connected to the second confinement space of the collecting pipe at the pod transfer chamber,
wherein the transfer chamber system exhaust part is activated to exhaust the internal atmosphere of the pod transfer chamber, and thereby the inert gas flows sequentially via the first confinement space, the second confinement space, the pressure regulator, and the pod transfer chamber, and
wherein the pressure regulator is configured to control pressures of the first confinement space and the second confinement space such that a relationship of (pressure of the substrate transfer chamber)>(pressure of the first confinement space)>(pressure of the second confinement space)>(pressure of the pod transfer chamber) is satisfied,
wherein the pressure regulator includes a pressure regulation structure communicating with the pod transfer chamber, the pressure regulation structure including:
a box-shaped structure comprising an internal space;
a hole installed at the box-shaped structure; and

a lid configured to adjust a degree of opening of the hole.

2. The apparatus according to claim 1 , wherein each of the plurality of reinforcement structures includes a flange, and each of the plurality of reinforcement structures is fixed to the wall by welding the flange to the wall.

3. The apparatus according to claim 2 , wherein the communication hole is installed at an upstream side of each of the plurality of reinforcement structures with respect to a flow of the inert gas.

4. The apparatus according to claim 3 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber, and
wherein the substrate transfer chamber system exhaust part is configured to stop an operation to exhaust an internal atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber.

5. The apparatus according to claim 3 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber,
wherein the substrate transfer chamber system exhaust part is configured to perform an operation to exhaust an atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber, and
wherein after lapse of a predetermined time, the substrate transfer chamber system exhaust part is configured to stop the operation while the inert gas supply part supplies the inert gas.

6. The apparatus according to claim 2 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber, and
wherein the substrate transfer chamber system exhaust part is configured to stop an operation to exhaust an internal atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber.

7. The apparatus according to claim 2 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber,
wherein the substrate transfer chamber system exhaust part is configured to perform an operation to exhaust an atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber, and
wherein after lapse of a predetermined time, the substrate transfer chamber system exhaust part is configured to stop the operation while the inert gas supply part supplies the inert gas.

8. The apparatus according to claim 1 , wherein the communication hole is installed at an upstream side of each of the plurality of reinforcement structures with respect to a flow of the inert gas.

9. The apparatus according to claim 8 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to exhaust an internal atmosphere of the substrate transfer chamber, and
wherein the substrate transfer chamber system exhaust part is configured to stop an operation to exhaust an internal atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber.

10. The apparatus according to claim 8 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to exhaust an internal atmosphere of the substrate transfer chamber, and
wherein the substrate transfer chamber system exhaust part is configured to perform an operation to exhaust an atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber, and
wherein after lapse of a predetermined time, the substrate transfer chamber system exhaust part is configured to stop the operation while the inert gas supply part supplies the inert gas.

11. The apparatus according to claim 1 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber, and
wherein the substrate transfer chamber system exhaust part is configured to stop an operation to exhaust an internal atmosphere from the substrate transfer chamber while the inert gas supply part supplies the inert gas to the housing in a state in which there is no substrate at the substrate transfer chamber.

12. The apparatus according to claim 1 , wherein a substrate transfer chamber system exhaust part is installed at the substrate transfer chamber, and configured to actively exhaust an internal atmosphere of the substrate transfer chamber,
wherein the substrate transfer chamber system exhaust part is configured t

Assignees

• Kokusai Electric Corp

Inventors

• Nakashima Seiyo

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/6334

  using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (deposition by physical ablation of a target H10P14/6329) · CPC title

• H10P72/3412 Primary

  Batch transfer of wafers · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/12

  Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements · CPC title