Plating support system, plating support device, and recording medium
US-11773504-B2 · Oct 3, 2023 · US
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Nakada Tsutomu patents
Nakada Tsutomu is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nakada Tsutomu |
| Total patents | 20 |
| First publication | Apr 2, 2015 |
| Latest publication | Oct 3, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Plating support system, plating support device, and recording medium
US-2021222315-A1 · Jul 22, 2021 · US
Electroplating device
US-10968530-B2 · Apr 6, 2021 · US
Plating apparatus and plating method
US-10914019-B2 · Feb 9, 2021 · US
Aquaporin 4 function promotor and pharmaceutical composition for neurological disorders
US-10632084-B2 · Apr 28, 2020 · US
Plating apparatus, plating method, and substrate holder
US-10513795-B2 · Dec 24, 2019 · US
Electroplating device
US-2019256997-A1 · Aug 22, 2019 · US
Plating apparatus, plating method, and substrate holder
US-2019249326-A1 · Aug 15, 2019 · US
Plating apparatus, plating method, and substrate holder
US-10316426-B2 · Jun 11, 2019 · US
Plating apparatus and plating method
US-2019127875-A1 · May 2, 2019 · US
Recent patents
Latest publications not already listed above.
Aquaporin 4 function promotor and pharmaceutical composition for neurological disorders
US-2019091182-A1 · Mar 28, 2019 · US
Anode unit and plating apparatus having such anode unit
US-9708724-B2 · Jul 18, 2017 · US
Plating apparatus, plating method, and substrate holder
US-2017058423-A1 · Mar 2, 2017 · US
Substrate processing apparatus and substrate processing method
US-9556533-B2 · Jan 31, 2017 · US
Electroless plating apparatus
US-2016160352-A1 · Jun 9, 2016 · US
Electroless plating apparatus and electroless plating method
US-9293364-B2 · Mar 22, 2016 · US
Anode unit and plating apparatus having such anode unit
US-2015275390-A1 · Oct 1, 2015 · US
Electroless plating method
US-2015267302-A1 · Sep 24, 2015 · US
Method for producing 18F-labeled compound and high molecular compound to be used in the method
US-9073802-B2 · Jul 7, 2015 · US
Plating apparatus and cleaning device used in the plating apparatus
US-2015090584-A1 · Apr 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 17 |
| Univ Niigata | 3 |
| Nakada Tsutomu | 2 |
| Takahashi Takashi | 1 |
| Tanaka Hiroshi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 13 |
| C25D17/007 | 8 |
| C25D21/10 | 8 |
| H10W72/01235 | 8 |
| C25D17/06 | 7 |