Plating apparatus, plating method, and substrate holder

Patent metadata

Field	Value
Publication number	US-10316426-B2
Application number	US-201615248248-A
Country	US
Kind code	B2
Filing date	Aug 26, 2016
Priority date	Aug 28, 2015
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

First claim

What is claimed is:

1. A plating apparatus, comprising:
an anode holder configured to hold an anode;
a substrate holder configured to hold a polygonal substrate;
a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution; and
a control device for controlling a current that flows between the anode and the substrate,
wherein the substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate, and
the control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members on at least one respective side of the polygonal substrate.

2. The plating apparatus according to claim 1 ,
wherein the power feeding members include first power feeding members capable of contacting side central regions including central portions of the sides of the polygonal substrate, and second power feeding members capable of contacting intermediate regions adjacent to the side central regions and/or third power feeding members capable of contacting regions that are closer to corner portions of the polygonal substrate than the intermediate regions, and
the control device is configured to be able to control the current to supply currents of different values respectively to the first power feeding members and the second power feeding members and/or the third power feeding members.

3. The plating apparatus according to claim 2 ,
wherein the control device is configured to be able to control the currents so that a value of a current that flows in the second power feeding members becomes larger than a value of a current that flows in the first power feeding members.

4. The plating apparatus according to claim 2 ,
wherein the control device is configured to be able to control the currents so that a current of a first value is supplied to the first power feeding members at a time of start of plating, and thereafter a current of a second value that is larger than the first value is supplied to the first power feeding members.

5. The plating apparatus according to claim 4 ,
wherein the control device is configured to be able to control the currents so that the current that flows in the first power feeding members increases stepwise from the first value to the second value.

6. The plating apparatus according to claim 4 ,
wherein the control device is configured to be able to control the currents so that the current which flows in the first power feeding members increases continuously from the first value to the second value.

7. The plating apparatus according to claim 2 ,
wherein the control device is configured to be able to control the currents so that a value of the current that flows in the third power feeding members becomes smaller than the value of the current that flows in the first power feeding members.

8. The plating apparatus according to claim 2 ,
wherein the third power feeding members are configured to contact regions other than points of intersection of the sides of the polygonal substrate.

Assignees

• Ebara Corp

Inventors

• Mine Junko
• Nakada Tsutomu
• Yahagi Mitsutoshi

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title