Plating apparatus and plating method

Patent metadata

Field	Value
Publication number	US-10914019-B2
Application number	US-201816174103-A
Country	US
Kind code	B2
Filing date	Oct 29, 2018
Priority date	Oct 31, 2017
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.

First claim

What is claimed is:

1. A plating apparatus for plating a substrate comprising:
a plating bath configured to accommodate plating solution;
a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution;
a support member for supporting a first end portion of the paddle;
a first magnet provided on the paddle; and
a second magnet provided on the plating bath, wherein
the first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving,
the second magnet includes a substrate-side magnet arranged on the substrate side of the first magnet, and an opposite-side magnet arranged on a side opposite to the substrate side of the first magnet,
the first magnet is sandwiched between the substrate-side magnet and the opposite-side magnet,
a first pole of the first magnet faces the substrate-side magnet, a second pole of the first magnet faces the opposite-side magnet, and
the substrate-side magnet and the opposite-side magnet are arranged so as to exert repulsive magnetic forces on the first magnet, respectively.

2. The plating apparatus according to claim 1 , wherein
the first magnet is provided on the second end portion of the paddle.

3. The plating apparatus according to claim 2 , wherein
the paddle extends from the first end portion to the second end portion, and
the second magnet is arranged to face the second end portion of the paddle in an extending direction of the paddle, and configured to exert a magnetic force attracting the first magnet on the first magnet.

4. The plating apparatus according to claim 1 , wherein
the paddle has a grid portion extending from the first end portion to the second end portion, and
the grid portion has at least a surface that is neither perpendicular nor parallel to a moving direction of the paddle.

5. A plating apparatus for plating a substrate comprising:
a plating bath configured to accommodate plating solution;
a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution;
a support member for supporting a first end portion of the paddle;
a first magnet provided on the paddle; and
a second magnet provided on the plating bath, wherein
the first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving,
the second magnet includes a substrate-side magnet arranged on the substrate side of the first magnet, and an opposite-side magnet arranged on a side opposite to the substrate side of the first magnet,
the first magnet is sandwiched between the substrate-side magnet and the opposite-side magnet,
any one of the substrate-side magnet and the opposite-side magnet is arranged so as to exert a repulsive magnetic force on the first magnet, and the other magnet of the substrate-side magnet and
the opposite-side magnet is arranged so as to exert a magnetic force attracting the first magnet on the first magnet.

Assignees

• Ebara Corp

Inventors

• Chang Shao Hua
• Masuda Yasuyuki
• Fujikata Jumpei
• Shimoyama Masashi
• Nakada Tsutomu

Classifications

• C25D21/10 Primary

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title