Structural arrangements for spatial power-combining devices
US-12525696-B2 · Jan 13, 2026 · US
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Murdock Dylan patents
Murdock Dylan is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Murdock Dylan |
| Total patents | 30 |
| First publication | Dec 14, 2017 |
| Latest publication | Jan 13, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Mechanical fastener arrangements in spatial power-combining devices and related methods
US-2025329909-A1 · Oct 23, 2025 · US
Hermetic package for high CTE mismatch
US-12266582-B2 · Apr 1, 2025 · US
Hermetic package for high CTE mismatch
US-12119281-B2 · Oct 15, 2024 · US
Structural arrangements for spatial power-combining devices
US-2024195041-A1 · Jun 13, 2024 · US
Structural arrangements for spatial power-combining devices
US-11955687-B2 · Apr 9, 2024 · US
Circuit package with improved thermal management
US-2024055319-A1 · Feb 15, 2024 · US
High power laminate RF package
US-11791251-B2 · Oct 17, 2023 · US
Structural arrangements for spatial power-combining devices
US-2023223673-A1 · Jul 13, 2023 · US
Thermal structures for heat transfer devices and spatial power-combining devices
US-11665867-B2 · May 30, 2023 · US
Recent patents
Latest publications not already listed above.
Power-combining devices with increased output power
US-11621469-B2 · Apr 4, 2023 · US
High power laminate rf package
US-2023036197-A1 · Feb 2, 2023 · US
Thermal structures for heat transfer devices and spatial power-combining devices
US-11564337-B2 · Jan 24, 2023 · US
Thermal structures for heat transfer devices and spatial power-combining devices
US-2022279676-A1 · Sep 1, 2022 · US
Power-combining devices with increased output power
US-2022247061-A1 · Aug 4, 2022 · US
Heat exchanger assemblies for electronic devices
US-11255608-B2 · Feb 22, 2022 · US
Hermetic package for high cte mismatch
US-2022044979-A1 · Feb 10, 2022 · US
Hermetic package for high cte mismatch
US-2022044981-A1 · Feb 10, 2022 · US
Heat exchanger assemblies for electronic devices and related methods
US-11162734-B2 · Nov 2, 2021 · US
Thermal structures for heat transfer devices and spatial power-combining devices
US-2021298207-A1 · Sep 23, 2021 · US
Structures for spatial power-combining devices
US-10855240-B2 · Dec 1, 2020 · US
Structures for spatial power-combining devices
US-2020162046-A1 · May 21, 2020 · US
Heat exchanger assemblies for electronic devices and related methods
US-2020041210-A1 · Feb 6, 2020 · US
Heat exchanger assemblies for electronic devices
US-2020041209-A1 · Feb 6, 2020 · US
Heat transfer device incorporating a helical flow element within a fluid conduit
US-10539371-B2 · Jan 21, 2020 · US
Environmentally robust plating configuration for metal-diamond composites substrate
US-10418257-B1 · Sep 17, 2019 · US
Heat transfer device incorporating a helical flow element within a fluid conduit
US-2018202722-A1 · Jul 19, 2018 · US
Modular semiconductor package
US-10015882-B1 · Jul 3, 2018 · US
Substrate with integrated heat spreader
US-9911678-B2 · Mar 6, 2018 · US
Substrate with integrated heat spreader
US-2017358515-A1 · Dec 14, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qorvo Us Inc | 30 |
| Triquint Semiconductor Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/258 | 10 |
| H01P5/12 | 9 |
| H10W90/754 | 8 |
| H05K7/209 | 8 |
| H10W72/5445 | 6 |