Thermal structures for heat transfer devices and spatial power-combining devices

Patent metadata

Field	Value
Publication number	US-11564337-B2
Application number	US-202016821531-A
Country	US
Kind code	B2
Filing date	Mar 17, 2020
Priority date	Mar 17, 2020
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

First claim

What is claimed is:

1. A spatial power-combining device for modifying a signal comprising a plurality of amplifier assemblies radially arranged around a center axis, wherein each amplifier assembly of the plurality of amplifier assemblies comprises:
an amplifier;
a body structure that is configured to support the amplifier, wherein the body structure comprises:
an inner surface and an opposing outer surface arranged such that the inner surface is positioned closer to the center axis than the outer surface; and
a first surface on which the amplifier is mounted and a second surface that opposes the first surface, wherein the first surface and the second surface form opposing sides of the body structure that are bounded by the inner surface and the outer surface;

and
a heat sink that is entirely embedded within the body structure and a longitudinal dimension of the heat sink from the inner surface to the outer surface is greater than a dimension of the heat sink from the first surface to the second surface.

2. The spatial power-combining device of claim 1 , wherein the heat sink is provided closer to the first surface of the body structure than the second surface of the body structure.

3. The spatial power-combining device of claim 1 , wherein the heat sink extends within the body structure in a lateral direction relative to the first surface of the body structure.

4. The spatial power-combining device of claim 3 , wherein the heat sink extends in the lateral direction a distance that is greater than one or more peripheral edges of the amplifier.

5. The spatial power-combining device of claim 1 , wherein the heat sink comprises a material having a higher thermal conductivity than the body structure.

6. The spatial power-combining device of claim 1 , wherein the heat sink comprises one or more of a metal, a ceramic, and a polymer.

7. The spatial power-combining device of claim 1 , wherein the heat sink comprises one or more of a heat pipe, a thermal ground plane, and a phase change material.

8. The spatial power-combining device of claim 1 , wherein the heat sink forms two parallel opposing faces within the body structure.

9. The spatial power-combining device of claim 1 , wherein the heat sink forms a cross-sectional wedge shape.

10. The spatial power-combining device of claim 1 , wherein the body structure is formed by additive manufacturing.

11. A spatial power-combining device for modifying a signal comprising a plurality of amplifier assemblies radially arranged around a center axis, wherein each amplifier assembly of the plurality of amplifier assemblies comprises:
an amplifier;
a body structure that is configured to support the amplifier, wherein the body structure comprises:
an inner surface and an opposing outer surface arranged such that the inner surface is positioned closer to the center axis than the outer surface; and
a first surface on which the amplifier is mounted and a second surface that opposes the first surface, wherein the first surface and the second surface form opposing sides of the body structure that are bounded by the inner surface and the outer surface;

and
a heat sink that is partially embedded within the body structure, the heat sink extending in a lateral direction relative to the first surface of the body structure a distance that is greater than one or more peripheral edges of the amplifier.

12. The spatial power-combining device of claim 11 , wherein the heat sink is provided closer to the first surface of the body structure than the second surface of the body structure.

13. The spatial power-combining device of claim 11 , wherein the heat sink extends in the lateral direction to the outer surface of the body structure such that a peripheral edge of the heat sink is exposed at the outer surface.

14. The spatial power-combining device of claim 11 , wherein at least a portion of the heat sink is exposed at the first surface of the body structure.

15. The spatial power-combining device of claim 11 , wherein the heat sink comprises a material having a higher thermal conductivity than the body structure.

16. The spatial power-combining device of claim 11 , wherein the heat sink comprises one or more of a metal, a ceramic, and a polymer.

17. The spatial power-combining device of claim 11 , wherein the heat sink comprises one or more of a heat pipe, a thermal ground plane, and a phase change material.

18. The spatial power-combining device of claim 11 , wherein the heat sink forms two parallel opposing faces within the body structure.

19. The spatial power-combining device of claim 11 , wherein the heat sink forms a cross-sectional wedge shape.

20. The spatial power-combining device of claim 11 , wherein the body structure is formed by additive manufacturing.

Assignees

• Qorvo Us Inc

Inventors

• Murdock Dylan

Classifications

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• H05K7/20936

  Liquid coolant with phase change · CPC title

• B22F5/10

  of articles with cavities or holes, not otherwise provided for in the preceding subgroups · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title