Heat exchanger assemblies for electronic devices

Patent metadata

Field	Value
Publication number	US-11255608-B2
Application number	US-201916288735-A
Country	US
Kind code	B2
Filing date	Feb 28, 2019
Priority date	Aug 6, 2018
Publication date	Feb 22, 2022
Grant date	Feb 22, 2022

Abstract

Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.

First claim

What is claimed is:

1. A heat exchanger assembly for an electronic device, comprising:
a heat transfer body comprising a first face and a second face that opposes the first face, wherein the first face forms a plurality of open passageways within the first face; and
a cover structure attached to areas of the first face that are between individual passageways of the plurality of open passageways, wherein the cover structure and the plurality of open passageways of the heat transfer body form a plurality of enclosed fluid conduits.

2. The heat exchanger assembly of claim 1 , wherein the cover structure comprises a plurality of ports that are configured to provide fluid to the plurality of enclosed fluid conduits.

3. The heat exchanger assembly of claim 1 , wherein the plurality of enclosed fluid conduits are arranged in different concentrations within different areas of the heat exchanger assembly.

4. The heat exchanger assembly of claim 1 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits is arranged with a different diameter than other enclosed fluid conduits of the plurality of enclosed fluid conduits.

5. The heat exchanger assembly of claim 1 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits comprises alternating concave and convex curved portions.

6. The heat exchanger assembly of claim 1 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits is configured to split into multiple enclosed fluid conduits between a first edge and a second edge of the heat transfer body.

7. The heat exchanger assembly of claim 1 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits transverses the heat exchanger assembly in a linear manner between two radially arranged fluid conduits of the plurality of enclosed fluid conduits.

8. The heat exchanger assembly of claim 1 , wherein the heat transfer body forms a cylindrical shape with a hollow center opening and the second face of the heat transfer body is oriented toward the hollow center opening.

9. A spatial power-combining device for modifying a signal comprising:
a center waveguide section configured between an input coaxial waveguide section and an output coaxial waveguide section; and
a heat exchanger assembly thermally coupled to the center waveguide section, the heat exchanger assembly comprising a heat transfer body and a cover structure attached to the heat transfer body, wherein the heat transfer body and the cover structure form a plurality of enclosed fluid conduits;
wherein the center waveguide section forms a cylindrical shape and the heat exchanger assembly forms a corresponding cylindrical shape with a hollow center opening, and wherein the center waveguide section is arranged inside the hollow center opening of the heat exchanger assembly and the center waveguide section is thermally coupled to an inner face of the heat transfer body.

10. The spatial power-combining device of claim 9 , wherein the center waveguide section comprises a plurality of amplifier assemblies radially arranged about a center axis.

11. The spatial power-combining device of claim 10 , wherein a body structure of each amplifier assembly of the plurality of amplifier assemblies comprises a same material as the heat transfer body.

12. The spatial power-combining device of claim 10 , wherein each amplifier assembly of the plurality of amplifier assemblies comprises an amplifier.

13. The spatial power-combining device of claim 12 , wherein the plurality of enclosed fluid conduits are arranged in different concentrations within different areas of the heat exchanger assembly and areas of the heat exchanger assembly that are registered with each amplifier comprise increased concentrations of enclosed fluid conduits.

14. The spatial power-combining device of claim 12 , wherein areas of the heat exchanger assembly that are registered with each amplifier comprise enclosed fluid conduits of the plurality of enclosed fluid conduits with diameters that are smaller than diameters of other enclosed fluid conduits of the plurality of enclosed fluid conduits.

15. The spatial power-combining device of claim 10 , further comprising:
an input coaxial waveguide section configured to concurrently provide a signal to an input antenna structure of each amplifier assembly of the plurality of amplifier assemblies; and
an output coaxial waveguide section configured to concurrently combine a signal from an output antenna structure of each amplifier assembly of the plurality of amplifier assemblies.

16. The spatial power-combining device of claim 15 , further comprising an input port configured to propagate a signal to the input coaxial waveguide section and an output port configured to receive an amplified signal from the output coaxial waveguide section.

17. The spatial power-combining device of claim 9 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits comprises alternating concave and convex curved portions.

18. A spatial power-combining device for modifying a signal comprising:
a center waveguide section configured between an input coaxial waveguide section and an output coaxial waveguide section and comprising a plurality of amplifier assemblies radially arranged about a center axis; and
a heat exchanger assembly thermally coupled to the center waveguide section, the heat exchanger assembly comprising a heat transfer body and a cover structure attached to the heat transfer body, wherein the heat transfer body and the cover structure form a plurality of enclosed fluid conduits;
wherein a body structure of each amplifier assembly of the plurality of amplifier assemblies comprises a same material as the heat transfer body.

19. The spatial power-combining device of claim 18 , wherein the plurality of enclosed fluid conduits are arranged in different concentrations within different areas of the heat exchanger assembly.

20. The spatial power-combining device of claim 18 , wherein at least one enclosed fluid conduit of the plurality of enclosed fluid conduits comprises alternating concave and convex curved portions.

Assignees

• Qorvo Us Inc

Inventors

• Valenti Gregory
• Murdock Dylan
• Jackson Eric

Classifications

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• F28D2021/0078

  in the form of cooling walls · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H01P1/262

  the dissipative medium being a liquid or being cooled by a liquid · CPC title

• F28D1/0443 Primary

  Combination of units extending one beside or one above the other (F28D1/0452 takes precedence) · CPC title