Substrate with integrated heat spreader

Patent metadata

Field	Value
Publication number	US-9911678-B2
Application number	US-201615295005-A
Country	US
Kind code	B2
Filing date	Oct 17, 2016
Priority date	Jun 13, 2016
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate core having a top surface and a bottom surface opposite the top surface of the substrate core;
at least one connecting structure extending through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core;
a heat spreader extending through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core; and
a core extension that extends from the bottom surface of the substrate core towards the bottom level and surrounds an extension portion of the heat spreader that extends below the bottom surface of the substrate core, wherein the bottom surface of the substrate core surrounds the core extension.

2. The apparatus of claim 1 further comprising a system heat sink, which has a top surface including a first surface portion and a second surface portion, and a printed circuit board (PCB) mounted over the first surface portion of the system heat sink, wherein the extension portion of the heat spreader and the core extension extend into an opening in the PCB, and the extension portion of the heat spreader is thermally coupled to the second surface portion of the system heat sink such that at least a portion of the PCB resides between the bottom surface of the substrate core and the first surface portion of the system heat sink.

3. The apparatus of claim 1 further comprising a bottom heat plate coupled to a bottom side of the heat spreader.

4. The apparatus of claim 3 wherein the bottom heat plate covers the bottom side of the heat spreader and a least a portion of a bottom side of the core extension.

5. The apparatus of claim 1 further comprising a top heat plate coupled to a top side of the heat spreader.

6. The apparatus of claim 5 wherein the top heat plate covers the top side of the heat spreader and at least a portion of the top surface of the substrate core.

7. The apparatus of claim 5 wherein the top heat plate is a ground plate.

8. The apparatus of claim 1 further comprising a bottom heat plate coupled to a bottom side of the heat spreader and a top heat plate coupled to a top side of the heat spreader.

9. An apparatus comprising:
a substrate core having a top surface and a bottom surface opposite the top surface of the substrate core;
at least one connecting structure extending through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core;
a heat spreader extending through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core;
a system heat sink, which has a top surface including a first surface portion and a second surface portion; and
a PCB mounted over the first surface portion of the system heat sink, wherein an extension portion of the heat spreader that extends below the bottom surface of the substrate core extends into an opening in the PCB and is thermally coupled to the second surface portion of the system heat sink such that at least a portion of the PCB resides between the bottom surface of the substrate core and the first surface portion of the system heat sink.

10. The apparatus of claim 9 wherein the first surface portion of the system heat sink and the second surface portion of the system heat sink are coplanar.

11. The apparatus of claim 10 wherein the system heat sink is formed from a flat metal plate or sheet.

12. The apparatus of claim 10 wherein the system heat sink is formed from a flat ceramic plate or sheet.

13. The apparatus of claim 9 wherein the first surface portion of the system heat sink resides along a first plane and the second surface portion of the system heat sink resides along a second plane that is different than the first plane.

14. The apparatus of claim 9 wherein the PCB has a thickness between 0 and 0.65 cm.

15. The apparatus of claim 1 wherein the heat spreader is coupled with the substrate core via an adhesive.

16. The apparatus of claim 1 wherein the heat spreader is directly coupled with the substrate core.

17. The apparatus of claim 1 wherein the heat spreader is formed from metallic or ceramic materials.

18. The apparatus of claim 1 wherein the extension portion of the heat spreader extends below the bottom surface of the substrate core by a distance between 0.01 cm and 0.4 cm.

19. The apparatus of claim 1 further comprising a die mounted over and thermally coupled to the heat spreader.

20. The apparatus of claim 19 wherein the die is a wire-bonding die including a wire-bonding die body and at least one wire, wherein:
the wire-bonding die body has a top surface and a bottom surface that is opposite the top surface of the wire-bonding die body and coupled to the heat spreader; and
the at least one wire extends from the top surface of the wire-bonding die body towards the at least one connecting structure.

21. The apparatus of claim 19 wherein the die is a flip-chip die including a flip-chip die body, at least one first interconnect, and at least one second interconnect, wherein:
the at least one first interconnect extends from a bottom surface of the flip-chip die body towards the heat spreader; and
the at least one second interconnect extends from the bottom surface of the flip-chip die body towards the at least one connecting structure.

22. An apparatus comprising:
a system heat sink, which has a top surface including a first surface portion and a second surface portion;
a PCB mounted over the first surface portion of the system heat sink;
a substrate including a substrate core, at least one connecting structure, and a heat spreader, wherein:
the substrate core has a top surface and a bottom surface opposite the top surface of the substrate core;
the at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core; and
the heat spreader extends through the substrate core and into an opening in the PCB, wherein the heat spreader is thermally coupled to the second surface portion of the system heat sink such that a least a portion of the PCB resides between the bottom surface of the substrate core and the first surface portion of the system heat sink; and

a die mounted over and thermally coupled to the heat spreader.

Assignees

• Qorvo Us Inc

Inventors

• Murdock Dylan

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title