Method of forming a photoresist layer
US-9875892-B2 · Jan 23, 2018 · US
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Mo Wang-Pen patents
Mo Wang-Pen is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mo Wang-Pen |
| Total patents | 14 |
| First publication | Jan 27, 2015 |
| Latest publication | Jan 23, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Lithography process on high topology features
US-9791775-B2 · Oct 17, 2017 · US
Film portion at wafer edge
US-9651869-B2 · May 16, 2017 · US
Lithography Process on High Topology Features
US-2016195807-A1 · Jul 7, 2016 · US
Film portion at wafer edge
US-9372406-B2 · Jun 21, 2016 · US
Thickening phase for spin coating process
US-9360755-B2 · Jun 7, 2016 · US
Test structure placement on a semiconductor wafer
US-9349662-B2 · May 24, 2016 · US
Lithography process on high topology features
US-9285677-B2 · Mar 15, 2016 · US
Method of fabricating a metal grid for semiconductor device
US-9153620-B2 · Oct 6, 2015 · US
Method of fabricating a metal grid for semiconductor device
US-2015249109-A1 · Sep 3, 2015 · US
Recent patents
Latest publications not already listed above.
Method of forming a photoresist layer
US-2015243500-A1 · Aug 27, 2015 · US
Film portion at wafer edge
US-2015212420-A1 · Jul 30, 2015 · US
Method of forming a photoresist layer
US-9028915-B2 · May 12, 2015 · US
Metal grid in backside illumination image sensor chips and methods for forming the same
US-8940574-B2 · Jan 27, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg | 11 |
| Taiwan Semiconductor Mfg Co Ltd | 3 |
| Wang Chih-Chien | 2 |
| Mo Wang-Pen | 2 |
| Hsieh Hung-Chang | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/20 | 6 |
| G03F7/091 | 6 |
| H10P72/0448 | 4 |
| B05D1/005 | 4 |
| G03F7/162 | 4 |