3D-microstrip branchline coupler
US-10832989-B2 · Nov 10, 2020 · US
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Mina Essam patents
Mina Essam is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mina Essam |
| Total patents | 17 |
| First publication | Jan 6, 2015 |
| Latest publication | Nov 10, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
3D-microstrip branchline coupler
US-10586752-B2 · Mar 10, 2020 · US
3d-microstrip branchline coupler
US-2020020612-A1 · Jan 16, 2020 · US
3d-microstrip branchline coupler
US-2018286785-A1 · Oct 4, 2018 · US
3D-microstrip branchline coupler
US-10037931-B2 · Jul 31, 2018 · US
3d-microstrip branchline coupler
US-2017330821-A1 · Nov 16, 2017 · US
3D-microstrip branchline coupler
US-9780429-B2 · Oct 3, 2017 · US
3d-microstrip branchline coupler
US-2017110778-A1 · Apr 20, 2017 · US
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
US-9553348-B2 · Jan 24, 2017 · US
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
US-2016226123-A1 · Aug 4, 2016 · US
Recent patents
Latest publications not already listed above.
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
US-9362606-B2 · Jun 7, 2016 · US
High performance on-chip vertical coaxial cable, method of manufacture and design structure
US-9054157-B2 · Jun 9, 2015 · US
Three dimensional branchline coupler using through silicon vias and design structures
US-9035719-B2 · May 19, 2015 · US
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
US-2015054592-A1 · Feb 26, 2015 · US
Three dimensional branchline coupler using through silicon vias and design structures
US-2015054595-A1 · Feb 26, 2015 · US
On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure
US-8963657-B2 · Feb 24, 2015 · US
Methodology on developing metal fill as library device
US-8930871-B2 · Jan 6, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 16 |
| Univ South Carolina | 5 |
| Univeristy Of South Carolina | 1 |
| Internatiional Business Machines Corp | 1 |
| Mina Essam | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F30/394 | 15 |
| H01P3/081 | 12 |
| H10W20/20 | 11 |
| H01P3/003 | 11 |
| G06F17/5077 | 11 |