Systems and methods for controlling a voltage waveform at a substrate during plasma processing
US-2026045456-A1 · Feb 12, 2026 · US
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Luere Olivier patents
Luere Olivier is listed as an inventor on 75 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Luere Olivier |
| Total patents | 75 |
| First publication | Jul 30, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for controlling a voltage waveform at a substrate during plasma processing
US-12456611-B2 · Oct 28, 2025 · US
Bias voltage modulation approach for SiO/SiN layer alternating etch process
US-12278110-B2 · Apr 15, 2025 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-12237148-B2 · Feb 25, 2025 · US
Wafer edge ring lifting solution
US-2024429088-A1 · Dec 26, 2024 · US
Feedback loop for controlling a pulsed voltage waveform
US-2024395502-A1 · Nov 28, 2024 · US
Wafer edge ring lifting solution
US-12094752-B2 · Sep 17, 2024 · US
Feedback loop for controlling a pulsed voltage waveform
US-12057292-B2 · Aug 6, 2024 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-2024030002-A1 · Jan 25, 2024 · US
Plasma processing using pulsed-voltage and radio-frequency power
US-11848176-B2 · Dec 19, 2023 · US
Recent patents
Latest publications not already listed above.
Creating Ion Energy Distribution Functions (IEDF)
US-2023352264-A1 · Nov 2, 2023 · US
Feedback loop for controlling a pulsed voltage waveform
US-2023326717-A1 · Oct 12, 2023 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-11776789-B2 · Oct 3, 2023 · US
Creating ion energy distribution functions (IEDF)
US-11728124-B2 · Aug 15, 2023 · US
BIAS VOLTAGE MODULATION APPROACH FOR SiO/SiN LAYER ALTERNATING ETCH PROCESS
US-2023223268-A1 · Jul 13, 2023 · US
Feedback loop for controlling a pulsed voltage waveform
US-11699572-B2 · Jul 11, 2023 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-2023030927-A1 · Feb 2, 2023 · US
In-situ deposition process
US-11521849-B2 · Dec 6, 2022 · US
High voltage filter assembly
US-11508554-B2 · Nov 22, 2022 · US
Methods and apparatus for processing a substrate
US-11482402-B2 · Oct 25, 2022 · US
Wafer edge ring lifting solution
US-2022319904-A1 · Oct 6, 2022 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-11462388-B2 · Oct 4, 2022 · US
Pulsed-voltage hardware assembly for use in a plasma processing system
US-11462389-B2 · Oct 4, 2022 · US
Wafer edge ring lifting solution
US-11393710-B2 · Jul 19, 2022 · US
Method of controlling ion energy distribution using a pulse generator
US-11284500-B2 · Mar 22, 2022 · US
Plasma processing assembly using pulsed-voltage and radio-frequency power
US-2022037119-A1 · Feb 3, 2022 · US
Plasma processing using pulsed-voltage and radio-frequency power
US-2022037121-A1 · Feb 3, 2022 · US
Pulsed-voltage hardware assembly for use in a plasma processing system
US-2022037120-A1 · Feb 3, 2022 · US
Creating ion energy distribution functions (iedf)
US-2021343496-A1 · Nov 4, 2021 · US
Creating ion energy distribution functions (IEDF)
US-11069504-B2 · Jul 20, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 75 |
| Luere Olivier | 2 |
| Chiang Kang-Lie | 1 |
| Choi Jinhan | 1 |
| Dorf Leonid | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/242 | 35 |
| H01J37/32715 | 33 |
| H10P50/283 | 33 |
| H01J2237/3341 | 33 |
| H01J37/32146 | 32 |