Matchless plasma source for semiconductor wafer fabrication
US-2026089828-A1 · Mar 26, 2026 · US
This page is not indexed by search engines while we improve data quality.
Long Maolin patents
Long Maolin is listed as an inventor on 137 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Long Maolin |
| Total patents | 137 |
| First publication | Jun 16, 2015 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Grid assembly for plasma processing apparatus
US-12580157-B2 · Mar 17, 2026 · US
Systems and methods for reverse pulsing
US-2026011531-A1 · Jan 8, 2026 · US
Rf pulsing within pulsing for semiconductor rf plasma processing
US-2025391638-A1 · Dec 25, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12507338-B2 · Dec 23, 2025 · US
Plasma Processing Apparatus
US-2025372353-A1 · Dec 4, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12490370-B2 · Dec 2, 2025 · US
Dual Frequency Matching Circuit for Inductively Coupled Plasma (ICP) Loads
US-2025364218-A1 · Nov 27, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-12484139-B2 · Nov 25, 2025 · US
Induction coil assembly for plasma processing apparatus
US-12476077-B2 · Nov 18, 2025 · US
Recent patents
Latest publications not already listed above.
Matchless plasma source for semiconductor wafer fabrication
US-12471202-B2 · Nov 11, 2025 · US
Systems and methods for reverse pulsing
US-12437966-B2 · Oct 7, 2025 · US
RF pulsing within pulsing for semiconductor RF plasma processing
US-12424410-B2 · Sep 23, 2025 · US
Workpiece Processing Apparatus with Outer Gas Channel Insert
US-2025293002-A1 · Sep 18, 2025 · US
Configurable Faraday Shield
US-2025293007-A1 · Sep 18, 2025 · US
Plasma processing apparatus
US-12417900-B2 · Sep 16, 2025 · US
Protection system for switches in direct drive circuits of substrate processing systems
US-2025273447-A1 · Aug 28, 2025 · US
Dual frequency matching circuit for inductively coupled plasma (ICP) loads
US-12400831-B2 · Aug 26, 2025 · US
Systems and methods for multi-level pulsing in rf plasma tools
US-2025232957-A1 · Jul 17, 2025 · US
Systems and methods for multi-level pulsing in rf plasma tools
US-2025226182-A1 · Jul 10, 2025 · US
Plasma Strip Tool With Movable Insert
US-2025218740-A1 · Jul 3, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025220801-A1 · Jul 3, 2025 · US
Pressure control system for a multi-head processing chamber of a plasma processing apparatus
US-12347661-B2 · Jul 1, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025212310-A1 · Jun 26, 2025 · US
Workpiece processing apparatus with outer gas channel insert
US-12340981-B2 · Jun 24, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025203748-A1 · Jun 19, 2025 · US
Hybrid Plasma Source Array
US-2025201517-A1 · Jun 19, 2025 · US
Matchless plasma source for semiconductor wafer fabrication
US-2025203749-A1 · Jun 19, 2025 · US
Configurable faraday shield
US-12334312-B2 · Jun 17, 2025 · US
Electrostatic Chuck Assembly for Plasma Processing Apparatus
US-2025191958-A1 · Jun 12, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 94 |
| Mattson Tech Inc | 43 |
| Beijing E Town Semiconductor Tech Co Ltd | 43 |
| Long Maolin | 5 |
| Paterson Alex | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/32183 | 67 |
| H01J37/321 | 64 |
| H01J37/32174 | 54 |
| H01J2237/334 | 51 |
| H01J37/3211 | 34 |