Thermally-aware semiconductor packages
US-12525578-B2 · Jan 13, 2026 · US
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Lin Ching-Yi patents
Lin Ching-Yi is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Ching-Yi |
| Total patents | 21 |
| First publication | Dec 1, 2015 |
| Latest publication | Jan 13, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Thermally-aware semiconductor packages
US-2025364496-A1 · Nov 27, 2025 · US
Semiconductor structure with integrated passive device having opposed solder bumps
US-2025349804-A1 · Nov 13, 2025 · US
Info packages including thermal dissipation blocks
US-2025309218-A1 · Oct 2, 2025 · US
Info packages including thermal dissipation blocks
US-12368148-B2 · Jul 22, 2025 · US
Systems and methods of estimating thermal properties of semiconductor devices
US-2025232105-A1 · Jul 17, 2025 · US
Systems and methods of estimating thermal properties of semiconductor devices
US-12299369-B2 · May 13, 2025 · US
Info packages including thermal dissipation blocks
US-2025054775-A1 · Feb 13, 2025 · US
Defect inspection method and defect inspection system
US-2025027886-A1 · Jan 23, 2025 · US
Info packages including thermal dissipation blocks
US-12159791-B2 · Dec 3, 2024 · US
Recent patents
Latest publications not already listed above.
Info packages including thermal dissipation blocks
US-2024213237-A1 · Jun 27, 2024 · US
Info packages including thermal dissipation blocks
US-11967591-B2 · Apr 23, 2024 · US
Info Packages Including Thermal Dissipation Blocks
US-2024021441-A1 · Jan 18, 2024 · US
Semiconductor structure with integrated passive device having opposed solder bumps
US-2023387078-A1 · Nov 30, 2023 · US
Info packages including thermal dissipation blocks
US-11817324-B2 · Nov 14, 2023 · US
Thermally-aware semiconductor packages
US-2023223379-A1 · Jul 13, 2023 · US
Systems and methods of estimating thermal properties of semiconductor devices
US-2023117009-A1 · Apr 20, 2023 · US
Info packages including thermal dissipation blocks
US-2023037331-A1 · Feb 9, 2023 · US
Info Packages Including Thermal Dissipation Blocks
US-2022367210-A1 · Nov 17, 2022 · US
Targeted power grid structure and method
US-2022328409-A1 · Oct 13, 2022 · US
Computer system and remote control method for computer device
US-9201663-B2 · Dec 1, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 20 |
| Acer Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/288 | 15 |
| H10W90/00 | 15 |
| H10W40/228 | 13 |
| H10W90/701 | 12 |
| H10W70/685 | 12 |