Method of manufacturing semiconductor package including semiconductor chip having internal and external marks
US-2026101766-A1 · Apr 9, 2026 · US
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Lee Wonil patents
Lee Wonil is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Wonil |
| Total patents | 58 |
| First publication | Feb 23, 2016 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package
US-12588567-B2 · Mar 24, 2026 · US
Semiconductor package
US-2026068687-A1 · Mar 5, 2026 · US
Method of manufacturing semiconductor package including thermal compression process
US-2026011666-A1 · Jan 8, 2026 · US
Display panel and electronic device including the same
US-2026007001-A1 · Jan 1, 2026 · US
Semiconductor device and method of fabricating the same
US-12512428-B2 · Dec 30, 2025 · US
Method and device for communication between network entities in cloud lan environment
US-2025393083-A1 · Dec 25, 2025 · US
Semiconductor chip and semiconductor package including bonding layers having alignment marks
US-12489071-B2 · Dec 2, 2025 · US
Semiconductor package, and method of manufacturing the same
US-12451449-B2 · Oct 21, 2025 · US
Interposer, method for fabricating the same, and semiconductor package having the same
US-12417988-B2 · Sep 16, 2025 · US
Recent patents
Latest publications not already listed above.
Method and device for communication between network entities in cloud LAN environment
US-12414167-B2 · Sep 9, 2025 · US
Touch sensing unit and display apparatus including the same
US-2025258571-A1 · Aug 14, 2025 · US
Semiconductor chip and semiconductor package including the same
US-2025201745-A1 · Jun 19, 2025 · US
Semiconductor chip and semiconductor package including the same
US-2025183206-A1 · Jun 5, 2025 · US
Method of quantifying magnetic resonance diffusion parameters by using diffusion weighted magnetic resonance images
US-12310713-B2 · May 27, 2025 · US
Semiconductor package
US-2024404955-A1 · Dec 5, 2024 · US
Method and device for communication between network entities in cloud lan environment
US-2024365405-A1 · Oct 31, 2024 · US
Semiconductor package
US-12087696-B2 · Sep 10, 2024 · US
Semiconductor devices
US-12080691-B2 · Sep 3, 2024 · US
Interposer, method for fabricating the same, and semiconductor package having the same
US-2024274553-A1 · Aug 15, 2024 · US
Method and device for communication between network entities in cloud LAN environment
US-12058744-B2 · Aug 6, 2024 · US
Interposer, method for fabricating the same, and semiconductor package having the same
US-11984415-B2 · May 14, 2024 · US
Method of quantifying magnetic resonance diffusion parameters by using diffusion weighted magnetic resonance images
US-2024148267-A1 · May 9, 2024 · US
Semiconductor package
US-2024096831-A1 · Mar 21, 2024 · US
Semiconductor package
US-2024038728-A1 · Feb 1, 2024 · US
Semiconductor device and method of fabricating the same
US-2023317654-A1 · Oct 5, 2023 · US
Method and apparatus for controlling handover in wireless communication system
US-11758454-B2 · Sep 12, 2023 · US
Method and device for communication between network entities in cloud lan environment
US-2023284297-A1 · Sep 7, 2023 · US
Semiconductor package
US-2023170304-A1 · Jun 1, 2023 · US
Method and device for communication between network entities in cloud LAN environment
US-11653396-B2 · May 16, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 50 |
| Samsung Sdi Co Ltd | 4 |
| Korea Advanced Inst Sci & Tech | 2 |
| Samsung Display Co Ltd | 2 |
| Samung Electronics Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 25 |
| H10W90/297 | 20 |
| H10W70/65 | 20 |
| H10W90/724 | 18 |
| H10W20/20 | 18 |