Integrated circuit devices including a boron-containing insulating pattern
US-10957647-B2 · Mar 23, 2021 · US
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Lee Mong-Sup patents
Lee Mong-Sup is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Mong-Sup |
| Total patents | 11 |
| First publication | Jun 18, 2015 |
| Latest publication | Mar 23, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit devices including a boron-containing insulating pattern
US-2020051921-A1 · Feb 13, 2020 · US
Method of manufactuing semiconductor device
US-10297495-B2 · May 21, 2019 · US
Method of manufacturing semiconductor device
US-10290537-B2 · May 14, 2019 · US
Method of manufacturing semiconductor device
US-2018226290-A1 · Aug 9, 2018 · US
Metthod of manufacturing semiconductor device
US-2017133262-A1 · May 11, 2017 · US
Method of manufacturing semiconductor device
US-9570316-B2 · Feb 14, 2017 · US
Semiconductor devices having plug insulators
US-9390961-B2 · Jul 12, 2016 · US
Wet etching nozzle, semiconductor manufacturing equipment including the same, and wet etching method using the same
US-2015340250-A1 · Nov 26, 2015 · US
Method of manufacturing semiconductor device
US-2015340281-A1 · Nov 26, 2015 · US
Recent patents
Latest publications not already listed above.
Semiconductor Device and Method of Fabricating the Same
US-2015171163-A1 · Jun 18, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/0335 | 10 |
| H10W20/069 | 8 |
| H10B12/482 | 8 |
| H10P74/203 | 6 |
| H10P74/23 | 6 |