Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same
US-12590247-B2 · Mar 31, 2026 · US
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Lee Hyosan patents
Lee Hyosan is listed as an inventor on 63 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Hyosan |
| Total patents | 63 |
| First publication | Jun 11, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Slurry composition for polishing metal and method of manufacturing integrated circuit device using the same
US-2026015524-A1 · Jan 15, 2026 · US
Etching composition and method for manufacturing semiconductor device using the same
US-2025277149-A1 · Sep 4, 2025 · US
Slurry composition for chemical mechanical polishing
US-12319841-B2 · Jun 3, 2025 · US
Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the same
US-2025163323-A1 · May 22, 2025 · US
Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the same
US-12234400-B2 · Feb 25, 2025 · US
Etching composition for titanium-containing layer, etching method of etching titanium-containing layer, and method of manufacturing semiconductor device using the etching composition
US-2024318078-A1 · Sep 26, 2024 · US
Etching composition and method of manufacturing integrated circuits using the same
US-2024059967-A1 · Feb 22, 2024 · US
Etching composition, method of etching metal-containing film by using the same, and method of manufacturing semiconductor device by using the same
US-2023407174-A1 · Dec 21, 2023 · US
Cleaning composition for removing residues on surface, method of cleaning metal-containing film by using the same, and method of manufacturing semiconductor device by using the same
US-2023383218-A1 · Nov 30, 2023 · US
Recent patents
Latest publications not already listed above.
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
US-11795550-B2 · Oct 24, 2023 · US
Slurry composition for polishing metal and method of manufacturing integrated circuit device using the same
US-2023332015-A1 · Oct 19, 2023 · US
Etching composition, method of etching metal-containing film by using the same, and method of manufacturing semiconductor device by using the same
US-2023313040-A1 · Oct 5, 2023 · US
Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the same
US-2023272280-A1 · Aug 31, 2023 · US
Etching composition for etching molybdenum film and method of manufacturing integrated circuit device using the same
US-2023272278-A1 · Aug 31, 2023 · US
Slurry composition for chemical mechanical polishing
US-2023104949-A1 · Apr 6, 2023 · US
Process chamber and substrate processing apparatus including the same
US-11610788-B2 · Mar 21, 2023 · US
Etchant compositions for metal-containing films and methods of manufacturing integrated circuit devices using the etchant compositions
US-11427759-B2 · Aug 30, 2022 · US
Etching composition and method for manufacturing semiconductor device using the same
US-11390805-B2 · Jul 19, 2022 · US
Slurry composition for chemical mechanical polishing
US-2021403756-A1 · Dec 30, 2021 · US
Substrate drying method, photoresist developing method, photolithography method including the same, and substrate drying system
US-11189503-B2 · Nov 30, 2021 · US
Silicon layer etchant composition and method of forming pattern by using the same
US-11168253-B2 · Nov 9, 2021 · US
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
US-2021254224-A1 · Aug 19, 2021 · US
Etching composition and method for manufacturing semiconductor device using the same
US-2021238478-A1 · Aug 5, 2021 · US
Process Chamber and Substrate Processing Apparatus Including the Same
US-2021217636-A1 · Jul 15, 2021 · US
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
US-11028488-B2 · Jun 8, 2021 · US
Process chamber and substrate processing apparatus including the same
US-10991600-B2 · Apr 27, 2021 · US
Etchant compositions for metal-containing films and methods of manufacturing integrated circuit devices using the etchant compositions
US-2021115334-A1 · Apr 22, 2021 · US
Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
US-2021098261-A1 · Apr 1, 2021 · US
Pre-treatment composition before etching SiGe and method of fabricating semiconductor device using the same
US-10837115-B2 · Nov 17, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 62 |
| Soulbrain Co Ltd | 9 |
| Dongwoo Fine Chem Co Ltd | 5 |
| Enf Technology Co Ltd | 2 |
| Lee Hyosan | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/667 | 22 |
| H10P50/283 | 21 |
| C09K13/06 | 20 |
| H01L21/31111 | 18 |
| H10P70/20 | 15 |