In-situ control of film properties during atomic layer deposition
US-2026011549-A1 · Jan 8, 2026 · US
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Kumar Purushottam patents
Kumar Purushottam is listed as an inventor on 118 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kumar Purushottam |
| Total patents | 118 |
| First publication | Feb 4, 2016 |
| Latest publication | Jan 8, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Dynamic precursor dosing for atomic layer deposition
US-12448687-B2 · Oct 21, 2025 · US
In-situ control of film properties during atomic layer deposition
US-12431349-B2 · Sep 30, 2025 · US
Dynamic process control in semiconductor manufacturing
US-2025266274-A1 · Aug 21, 2025 · US
Ultrathin atomic layer deposition film accuracy thickness control
US-12354871-B2 · Jul 8, 2025 · US
Dynamic process control in semiconductor manufacturing
US-12322619-B2 · Jun 3, 2025 · US
Modifying hydrophobicity of a wafer surface using an organosilicon precursor
US-12288685-B2 · Apr 29, 2025 · US
Method for providing doped silicon using a diffusion barrier layer
US-2025046613-A1 · Feb 6, 2025 · US
Apparatus for cleaning plasma chambers
US-2024395513-A1 · Nov 28, 2024 · US
Method for providing doped silicon using a diffusion barrier layer
US-12125705-B2 · Oct 22, 2024 · US
Recent patents
Latest publications not already listed above.
Low-k ald gap-fill methods and material
US-2024347337-A1 · Oct 17, 2024 · US
Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system
US-12077859-B2 · Sep 3, 2024 · US
Apparatus for cleaning plasma chambers
US-12057300-B2 · Aug 6, 2024 · US
Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching
US-12049699-B2 · Jul 30, 2024 · US
Dynamic precursor dosing for atomic layer deposition
US-2024240316-A1 · Jul 18, 2024 · US
Low-κ ALD gap-fill methods and material
US-12020923-B2 · Jun 25, 2024 · US
Method and apparatus for modulating film uniformity
US-2024183034-A1 · Jun 6, 2024 · US
Dynamic precursor dosing for atomic layer deposition
US-11970772-B2 · Apr 30, 2024 · US
Method and apparatus for modulating film uniformity
US-11913113-B2 · Feb 27, 2024 · US
Ultrathin atomic layer deposition film accuracy thickness control
US-2023298884-A1 · Sep 21, 2023 · US
Method of atomic layer deposition
US-11670503-B2 · Jun 6, 2023 · US
Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
US-11651963-B2 · May 16, 2023 · US
Ultrathin atomic layer deposition film accuracy thickness control
US-11646198-B2 · May 9, 2023 · US
Multi-cycle ALD process for film uniformity and thickness profile modulation
US-11479856-B2 · Oct 25, 2022 · US
Gas feed system for surface modified depth controlled deposition for plasma based deposition
US-2022301866-A1 · Sep 22, 2022 · US
Dynamic process control in semiconductor manufacturing
US-2022293442-A1 · Sep 15, 2022 · US
In-situ control of film properties during atomic layer deposition
US-2022238325-A1 · Jul 28, 2022 · US
Dielectric gapfill using atomic layer deposition (ald), inhibitor plasma and etching
US-2022205096-A1 · Jun 30, 2022 · US
Surface modified depth controlled deposition for plasma based deposition
US-11373862-B2 · Jun 28, 2022 · US
Apparatus for cleaning plasma chambers
US-2022181128-A1 · Jun 9, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 116 |
| Intel Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6339 | 78 |
| C23C16/52 | 61 |
| H10P14/6336 | 61 |
| H01L21/0228 | 59 |
| H10P14/69215 | 52 |