Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film

Patent metadata

Field	Value
Publication number	US-11651963-B2
Application number	US-202117204758-A
Country	US
Kind code	B2
Filing date	Mar 17, 2021
Priority date	Nov 29, 2017
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A method for forming features over a wafer with a carbon based deposition is provided. The carbon based deposition is pretuned, wherein the pretuning causes a non-uniform removal of some of the carbon based deposition. An oxide deposition is deposited through an atomic layer deposition process, wherein the depositing the oxide deposition causes a non-uniform removal of some of the carbon based deposition. At least one additional process is provided, wherein the at least one additional process completes formation of features over the wafer, wherein the features are more uniform than features that would be formed without pretuning.

First claim

What is claimed is:

1. A method for forming features over a wafer with a carbon based deposition, comprising:
pretuning the carbon based deposition, wherein the pretuning causes a non-uniform removal of some of the carbon based deposition;
depositing an oxide deposition through an atomic layer deposition process, wherein the depositing the oxide deposition causes a non-uniform removal of some of the carbon based deposition; and
providing at least one additional process, wherein the at least one additional process completes formation of features over the wafer, wherein the features are more uniform than features that are formed without pretuning.

2. The method, as recited in claim 1 , wherein the features are more uniform across the wafer.

3. The method, as recited in claim 1 , further comprising:
removing the carbon based deposition; and
etching an etch layer below the oxide deposition, using the oxide deposition as a mask.

4. The method, as recited in claim 1 , wherein the pretuning the carbon based deposition, comprises:
providing a pretuning gas comprising oxygen and at least one of Ar or nitrogen,
transforming the pretuning gas into a plasma, which causes a non-uniform removal of some of the carbon based deposition; and
stopping the pretuning gas.

5. The method, as recited in claim 4 , wherein the pretuning gas comprises oxygen and argon, wherein a ratio of the oxygen to argon is between 2:1 to 1:2.

6. The method, as recited in claim 1 , wherein the pretuning removes less than 20 {acute over (Å)} thickness of the carbon based deposition.

7. The method, as recited in claim 1 , wherein the depositing the oxide deposition comprises:
providing a lower energy oxide deposition of a plurality of cycles, wherein each cycle comprises:
flowing a precursor gas;
flowing an oxidation gas;
providing a first RF power to transform the oxidation gas into a plasma; and

providing a higher energy oxide deposition of a plurality of cycles, wherein each cycle comprises:
flowing a precursor gas;
flowing an oxidation gas; and
providing a second RF power to transform the oxidation gas into a plasma, wherein the second RF power is higher than the first RF power.

8. The method, as recited in claim 1 , further comprising providing at least one of a feedback or feedforward input to optimize the pretuning.

9. The method, as recited in claim 1 , further comprising forming a carbon based deposition over the wafer.

10. The method, as recited in claim 1 , wherein the carbon based deposition forms a plurality of mask features and the non-uniform removal of some of the carbon based deposition causes a non-uniformity between the plurality of mask features wherein at least one of the plurality of mask features is etched to a greater degree than the other of the plurality of mask features to provide the non-uniformity.

11. The method, as recited claim 10 , where the non-uniformity between the plurality of mask features results into an increased uniformity of the features.

12. The method, as recited in claim 11 , wherein the increased uniformity of the features is across the wafer.

Assignees

• Lam Res Corp

Inventors

• Karim Ishtak
• Agarwal Pulkit
• Abel Joseph R
• Kumar Purushottam
• Lavoie Adrien

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P76/204

  of organic photoresist masks · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6687

  the compound comprising silicon and nitrogen · CPC title