Determination of undercut sidewalls based on an image of a semiconductor specimen
US-2025232424-A1 · Jul 17, 2025 · US
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Kris Roman patents
Kris Roman is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kris Roman |
| Total patents | 35 |
| First publication | Oct 20, 2015 |
| Latest publication | Jul 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for registration between images informative of one or more semiconductor specimens
US-2025225646-A1 · Jul 10, 2025 · US
Examination of a hole formed in a semiconductor specimen
US-12347734-B2 · Jul 1, 2025 · US
Examination of a hole formed in a semiconductor specimen
US-2023420308-A1 · Dec 28, 2023 · US
Determining a critical dimension variation of a pattern
US-11756188-B2 · Sep 12, 2023 · US
Local shape deviation in a semiconductor specimen
US-11686571-B2 · Jun 27, 2023 · US
Method, system and computer program product for 3D-NAND CDSEM metrology
US-11651509-B2 · May 16, 2023 · US
Local shape deviation in a semiconductor specimen
US-2023069303-A1 · Mar 2, 2023 · US
Evaluating an intermediate product related to a three-dimensional NAND memory unit
US-11476081-B2 · Oct 18, 2022 · US
Epitaxy metrology in fin field effect transistors
US-11455715-B2 · Sep 27, 2022 · US
Recent patents
Latest publications not already listed above.
Generating a metrology recipe usable for examination of a semiconductor specimen
US-11443420-B2 · Sep 13, 2022 · US
Epitaxy metrology in fin field effect transistors
US-2022261979-A1 · Aug 18, 2022 · US
Generating a metrology recipe usable for examination of a semiconductor specimen
US-2022207681-A1 · Jun 30, 2022 · US
Determining a critical dimension variation of a pattern
US-2022198639-A1 · Jun 23, 2022 · US
Measuring height difference in patterns on semiconductor wafers
US-11301983-B2 · Apr 12, 2022 · US
Determining a critical dimension variation of a pattern
US-11276160-B2 · Mar 15, 2022 · US
Method, system and computer program product for 3d-nand cdsem metrology
US-2021383529-A1 · Dec 9, 2021 · US
Evaluating a hole formed in an intermediate product
US-11056404-B1 · Jul 6, 2021 · US
Evaluating a hole formed in an intermediate product
US-2021193536-A1 · Jun 24, 2021 · US
Evaluating an intermediate product related to a three-dimensional nand memory unit
US-2021066026-A1 · Mar 4, 2021 · US
Measuring height difference in patterns on semiconductor wafers
US-2020380668-A1 · Dec 3, 2020 · US
Determining a critical dimension variation of a pattern
US-2020327652-A1 · Oct 15, 2020 · US
Measuring height difference in patterns on semiconductor wafers
US-10748272-B2 · Aug 18, 2020 · US
Method for monitoring nanometric structures
US-10731979-B2 · Aug 4, 2020 · US
Method for monitoring nanometric structures
US-2019219390-A1 · Jul 18, 2019 · US
Technique for measuring overlay between layers of a multilayer structure
US-10354376-B2 · Jul 16, 2019 · US
Measuring height difference in patterns on semiconductor wafers
US-2018336675-A1 · Nov 22, 2018 · US
Technique for measuring overlay between layers of a multilayer structure
US-2018268539-A1 · Sep 20, 2018 · US
Technique for measuring overlay between layers of a multilayer structure
US-9916652-B2 · Mar 13, 2018 · US
CD-SEM technique for wafers fabrication control
US-9824852-B2 · Nov 21, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Israel Ltd | 37 |
| Applied Materials Israel Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/30148 | 31 |
| G06T7/0004 | 22 |
| H10P74/203 | 21 |
| G06T2207/10061 | 16 |
| G06T7/001 | 15 |