Methods to selectively embed magnetic materials in substrate and corresponding structures
US-12154715-B2 · Nov 26, 2024 · US
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Kim Seo Young patents
Kim Seo Young is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kim Seo Young |
| Total patents | 19 |
| First publication | Jul 4, 2019 |
| Latest publication | Nov 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate assembly with encapsulated magnetic feature
US-11901115-B2 · Feb 13, 2024 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-11735537-B2 · Aug 22, 2023 · US
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-2022367104-A1 · Nov 17, 2022 · US
Substrate assembly with encapsulated magnetic feature
US-2022359115-A1 · Nov 10, 2022 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-2022328431-A1 · Oct 13, 2022 · US
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-11450471-B2 · Sep 20, 2022 · US
Substrate assembly with encapsulated magnetic feature
US-11443892-B2 · Sep 13, 2022 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-11417614-B2 · Aug 16, 2022 · US
Embedding magnetic material, in a cored or coreless semiconductor package
US-11355459-B2 · Jun 7, 2022 · US
Recent patents
Latest publications not already listed above.
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US-10971492-B2 · Apr 6, 2021 · US
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US-2020251467-A1 · Aug 6, 2020 · US
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US-10643994-B2 · May 5, 2020 · US
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US-2019393217-A1 · Dec 26, 2019 · US
Embedding magnetic material in a cored or coreless semiconductor package
US-2019355675-A1 · Nov 21, 2019 · US
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-2019304661-A1 · Oct 3, 2019 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-2019304933-A1 · Oct 3, 2019 · US
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US-10373951-B1 · Aug 6, 2019 · US
Missing bump prevention from galvanic corrosion by copper bump sidewall protection
US-2019206822-A1 · Jul 4, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 19 |
| Intel Corpoation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 19 |
| H10D1/20 | 16 |
| H10W70/685 | 14 |
| H10W44/501 | 11 |
| H01F17/0006 | 11 |