Semiconductor package and method for manufacturing the same
US-2026090411-A1 · Mar 26, 2026 · US
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Kim Jong Youn patents
Kim Jong Youn is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kim Jong Youn |
| Total patents | 14 |
| First publication | Jun 18, 2020 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package including a bridge die and manufacturing method thereof
US-2026068717-A1 · Mar 5, 2026 · US
Semiconductor package
US-12009277-B2 · Jun 11, 2024 · US
Semiconductor package with marking patterns
US-2024170413-A1 · May 23, 2024 · US
Semiconductor package
US-11967549-B2 · Apr 23, 2024 · US
Semiconductor package
US-2024014163-A1 · Jan 11, 2024 · US
Semiconductor package
US-2022352050-A1 · Nov 3, 2022 · US
Semiconductor package
US-11404346-B2 · Aug 2, 2022 · US
Semiconductor package
US-11373980-B2 · Jun 28, 2022 · US
Semiconductor package
US-2022044992-A1 · Feb 10, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor package having multi-level and multi-directional shape narrowing vias
US-11177205-B2 · Nov 16, 2021 · US
Semiconductor package
US-2021020608-A1 · Jan 21, 2021 · US
Semiconductor package
US-2020411405-A1 · Dec 31, 2020 · US
Semiconductor package
US-2020194362-A1 · Jun 18, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 14 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 14 |
| H10W90/724 | 12 |
| H10W74/117 | 11 |
| H10W72/252 | 11 |
| H10P72/7424 | 11 |