Method and apparatus for using universal cavity wafer in wafer level packaging
US-10418249-B2 · Sep 17, 2019 · US
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Karpman Maurice patents
Karpman Maurice is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Karpman Maurice |
| Total patents | 8 |
| First publication | Jun 25, 2015 |
| Latest publication | Sep 17, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Method and apparatus for using universal cavity wafer in wafer level packaging
US-2018108533-A1 · Apr 19, 2018 · US
Method and apparatus for using universal cavity wafer in wafer level packaging
US-9847230-B2 · Dec 19, 2017 · US
Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
US-9735128-B2 · Aug 15, 2017 · US
Method and apparatus for using universal cavity wafer in wafer level packaging
US-2016365321-A1 · Dec 15, 2016 · US
Method for interconnecting die and substrate in an electronic package
US-9293440-B2 · Mar 22, 2016 · US
Method for embedding a chipset having an intermediary interposer in high density electronic modules
US-9257355-B2 · Feb 9, 2016 · US
Method for interconnecting die and substrate in an electronic package
US-2015179609-A1 · Jun 25, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Charles Stark Draper Laboratory Inc | 5 |
| Draper Lab Charles S | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/734 | 8 |
| H10W72/0198 | 7 |
| H10W72/9413 | 6 |
| H10W72/874 | 6 |
| H10W70/682 | 5 |